XC3S1200E-4FTG256I Xilinx Inc, XC3S1200E-4FTG256I Datasheet - Page 128

IC FPGA SPARTAN3E 1200K 256FTBGA

XC3S1200E-4FTG256I

Manufacturer Part Number
XC3S1200E-4FTG256I
Description
IC FPGA SPARTAN3E 1200K 256FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet

Specifications of XC3S1200E-4FTG256I

Number Of Logic Elements/cells
19512
Number Of Labs/clbs
2168
Total Ram Bits
516096
Number Of I /o
190
Number Of Gates
1200000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-LBGA
Package
256FTBGA
Family Name
Spartan®-3E
Device Logic Cells
19512
Device Logic Units
2168
Device System Gates
1200000
Number Of Registers
17344
Maximum Internal Frequency
572 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
190
Ram Bits
516096
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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DC and Switching Characteristics
Table 87: Pin-to-Pin Setup and Hold Times for the IOB Input Path (System Synchronous)
128
Notes:
1.
2.
3.
4.
Setup Times
T
T
Hold Times
T
T
Symbol
PSDCM
PSFD
PHDCM
PHFD
The numbers in this table are tested using the methodology presented in
Table 77
This setup time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or the data
Input. If this is true of the Global Clock Input, subtract the appropriate adjustment from
appropriate Input adjustment from the same table.
This hold time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the Global Clock Input or the data
Input. If this is true of the Global Clock Input, add the appropriate Input adjustment from
appropriate Input adjustment from the same table. When the hold time is negative, it is possible to change the data before the clock’s active
edge.
DCM output jitter is included in all measurements.
and
When writing to the Input
Flip-Flop (IFF), the time from the
setup of data at the Input pin to
the active transition at a Global
Clock pin. The DCM is used. No
Input Delay is programmed.
When writing to IFF, the time
from the setup of data at the
Input pin to an active transition
at the Global Clock pin. The
DCM is not used. The Input
Delay is programmed.
When writing to IFF, the time
from the active transition at the
Global Clock pin to the point
when data must be held at the
Input pin. The DCM is used. No
Input Delay is programmed.
When writing to IFF, the time
from the active transition at the
Global Clock pin to the point
when data must be held at the
Input pin. The DCM is not used.
The Input Delay is programmed.
Table
80.
Description
LVCMOS25
IFD_DELAY_VALUE = 0,
with DCM
LVCMOS25
IFD_DELAY_VALUE =
default software setting
LVCMOS25
IFD_DELAY_VALUE = 0,
with DCM
LVCMOS25
IFD_DELAY_VALUE =
default software setting
Conditions
(4)
(4)
www.xilinx.com
(2)
(2)
(3)
(3)
,
,
,
,
Table 95
DELAY_
VALUE=
IFD_
0
2
3
3
3
3
0
2
3
3
3
3
and are based on the operating conditions set forth in
XC3S100E
XC3S250E
XC3S500E
XC3S1200E
XC3S1600E
XC3S100E
XC3S250E
XC3S500E
XC3S1200E
XC3S1600E
XC3S100E
XC3S250E
XC3S500E
XC3S1200E
XC3S1600E
XC3S100E
XC3S250E
XC3S500E
XC3S1200E
XC3S1600E
Table
Table
Device
91. If this is true of the data Input, subtract the
91. If this is true of the data Input, add the
DS312-3 (v3.8) August 26, 2009
–0.54
–0.31
–0.32
–0.77
–0.05
2.65
2.25
2.25
2.25
2.25
3.16
3.44
4.00
2.60
3.33
0.06
0.07
0.07
0.06
0.13
Min
-5
Speed Grade
Product Specification
–0.52
–0.24
–0.32
–0.77
–0.03
2.98
2.59
2.59
2.58
2.59
3.58
3.91
4.73
3.31
3.77
0.14
0.14
0.15
0.14
0.16
Min
-4
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
R

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