XC3SD1800A-5FGG676C Xilinx Inc, XC3SD1800A-5FGG676C Datasheet - Page 65
![SPARTAN-3ADSP FPGA 1800K 676FBGA](/photos/6/73/67300/b-676_sml.jpg)
XC3SD1800A-5FGG676C
Manufacturer Part Number
XC3SD1800A-5FGG676C
Description
SPARTAN-3ADSP FPGA 1800K 676FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3A DSPr
Datasheets
1.XC3S50A-4VQG100C.pdf
(7 pages)
2.XC3SD3400A-4FGG676C.pdf
(4 pages)
3.XC3SD3400A-4FGG676C.pdf
(101 pages)
Specifications of XC3SD1800A-5FGG676C
Number Of Logic Elements/cells
37440
Number Of Labs/clbs
4160
Total Ram Bits
1548288
Number Of I /o
519
Number Of Gates
1800000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
676-BBGA
For Use With
122-1574 - KIT DEVELOPMENT SPARTAN 3ADSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3SD1800A-5FGG676C
Manufacturer:
XilinxInc
Quantity:
3 000
Company:
Part Number:
XC3SD1800A-5FGG676C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Company:
Part Number:
XC3SD1800A-5FGG676C
Manufacturer:
XILINX
Quantity:
160
Part Number:
XC3SD1800A-5FGG676C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Package Thermal Characteristics
The power dissipated by an FPGA application has implications on package selection and system design. The power
consumed by a Spartan-3A DSP FPGA is reported using either the
calculator integrated in the Xilinx ISE® development software.
Spartan-3A DSP device package offerings. This information is also available using the
The junction-to-case thermal resistance (θ
body (case) and the die junction temperature per watt of power consumption. The junction-to-board (θ
reports the difference between the board and junction temperature. The junction-to-ambient (θ
temperature difference between the ambient environment and the junction temperature. The θ
different air velocities, measured in linear feet per minute (LFM). The “Still Air (0 LFM)” column shows the θ
system without a fan. The thermal resistance drops with increasing air flow.
Table 62: Spartan-3A DSP FPGA Package Thermal Characteristics
DS610 (v3.0) October 4, 2010
Product Specification
Package
CSG484
FGG676
CS484
FG676
XC3SD1800A
XC3SD3400A
XC3SD1800A
XC3SD3400A
Device
Junction-to-Case
(θ
4.1
3.5
4.7
3.8
JC
)
JC
) indicates the difference between the temperature measured on the package
Junction-to-
Board (θ
www.xilinx.com
6.8
5.6
7.8
6.4
JB
)
Table 62
(0 LFM)
Still Air
Spartan-3A DSP FPGA Family: Pinout Descriptions
XPower Power Estimator
18.0
16.9
15.9
14.7
provides the thermal characteristics for the various
Junction-to-Ambient (θ
at Different Air Flows
250 LFM
13.3
12.2
11.6
10.5
Thermal Query
500 LFM
12.3
11.0
10.6
9.4
or the
JA
JA
) value reports the
value is reported at
JA
XPower Analyzer
)
750 LFM
JB
tool.
11.5
10.4
10.0
) value similarly
8.9
JA
value in a
Units
°C/W
°C/W
°C/W
°C/W
65