MPC8349VVALFB Freescale Semiconductor, MPC8349VVALFB Datasheet - Page 54
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MPC8349VVALFB
Manufacturer Part Number
MPC8349VVALFB
Description
IC MPU POWERQUICC II 672-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheet
1.MPC8349VVALFB.pdf
(87 pages)
Specifications of MPC8349VVALFB
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
667MHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
672-TBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8349E-MITXE
Maximum Clock Frequency
667 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
667MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.3V
Operating Supply Voltage (max)
1.36V
Operating Supply Voltage (min)
1.24V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
672
Package Type
TBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
667MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
TBGA
No. Of Pins
672
Rohs Compliant
Yes
For Use With
MPC8349E-MITX-GP - KIT REFERENCE PLATFORM MPC8349EMPC8349E-MITXE - BOARD REFERENCE FOR MPC8349MPC8349EA-MDS-PB - KIT MODULAR DEV SYSTEM MPC8349E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8349VVALFB
Manufacturer:
AD
Quantity:
8 557
Company:
Part Number:
MPC8349VVALFB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package and Pin Listings
18.1
The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape
ball grid array (TBGA).
54
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
Package Parameters for the MPC8349EA TBGA
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
672
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
96.5 Sn/3.5Ag (VV package)
0.64 mm
35 mm × 35 mm
Freescale Semiconductor