MPC8313EZQAFFB Freescale Semiconductor, MPC8313EZQAFFB Datasheet - Page 77

• Manufacturer Part Number: MPC8313EZQAFFB
• Description: IC MPU POWERQUICC II PRO 516PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8313EZQAFFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 333MHz
• Voltage: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8313E-RDB
• Maximum Clock Frequency: 333 MHz
• Operating Supply Voltage: 1 V, 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1 V, 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• For Use With: MPC8313E-RDB - BOARD PROCESSOR
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

20 Clocking
Figure 57
1
2
Freescale Semiconductor
USB_CR_CLK_OUT
SYS_CR_CLK_OUT
CFG_CLKIN_DIV
Multiplication factor M = 1, 1.5, 2, 2.5, and 3. Value is decided by RCWLR[COREPLL].
Multiplication factor L = 2, 3, 4, 5, and 6. Value is decided by RCWLR[SPMF].
125-MHz Source
USB_CR_CLK_IN
SYS_CR_CLK_IN
USB_CLK_IN
SYS_CLK_IN
Crystal
Crystal
GTX_CLK125
shows the internal distribution of clocks within the MPC8313E.
MPC8313E PowerQUICC
Converter
Protocol
eTSEC
MPC8313E
USB Mac
USB PHY
mux
/1,/2
PLL
Figure 57. MPC8313E Clock Subsystem
x L
System
PLL
2
e300c3 Core
™
II Pro Processor Hardware Specifications, Rev. 3
Divider (÷2)
PCI Clock
Clock
csb_clk
Unit
csb_clk to Rest
of the Device
x M
ddr_clk
lbc_clk
Core PLL
To Local Bus
1
Controller
To DDR
Memory
Sys Ref
Divider
Divider
Clock
/n
DDR
Clock
1
0
LBC
/2
core_clk
RTC
3
MEMC_MCK
MEMC_MCK
LCLK[0:1]
PCI_SYNC_OUT
PCI_CLK_OUT[0:2]
RTC_CLK (32 kHz)
PCI_CLK/
PCI_SYNC_IN
Local Bus
Memory
Device
DDR
Memory
Device
Clocking
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