MPC8247VRMIBA Freescale Semiconductor, MPC8247VRMIBA Datasheet - Page 59

• Manufacturer Part Number: MPC8247VRMIBA
• Description: IC MPU POWERQUICC II 516-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8247VRMIBA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 266MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 266MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5V
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 516
• Package Type: TEPBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 266 MHz
• Operating Supply Voltage: 1.4 V to 1.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 4 KB
• I/o Voltage: 3.3 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 14
• Program Memory Size: 16 KB
• Program Memory Type: EEPROM
• Core Size: 32 Bit
• Cpu Speed: 266MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 516
• Supply Voltage Range: 1.425V To 1.575V
• Rohs Compliant: Yes
• For Use With: CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

Freescale Semiconductor
Revision
0.2
0.1
0
12/2003
9/2003
5/2003
Date
•
•
•
•
•
•
•
•
• Sections 4.1–4.5 and 4.7 on thermal characteristics: New
•
• Addition of “Note: Temperature Reflow for the VR Package" on page 55
•
•
•
•
• Addition of the MPC8271 and the MPC8247 (these devices do not have a security engine)
•
•
• Modification of note 1 for
•
•
• Addition of ZQ package code to
NDA release
MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 2
Table
Table
Table
Table
Table 5
CPCI_HS_ES to PCI_REQ1 (AF14)
CPCI_HS_LED to PCI_GNT1 (AE13)
CPCI_HS_ENUM to PCI_GNT2 (AF21)
Table 5
on other PowerQUICC II devices:
PCI_CFG0 (PCI_HOST_EN) (AC21)
PCI_CFG1 (PCI_ARB_EN) (AE22)
PCI_CFG2 (DLL_ENABLE) (AE23)
PCI_PAR (AF12)
PCI_FRAME (AD15)
PCI_TRDY(AF16)
PCI_IRDY (AF15)
PCI_STOP (AE15)
DEVSEL (AE14)
PCI_IDSEL (AC17)
PCI_PERR (AD14)
PCI_SERR (AD13)
PCI_REQ0–2 (AAE20, AF14, AB14)
PCI_GNT0–2 (AD20, AE13, AF21)
PCI_RST (AF22)
PCI_INTA (AE21)
PCI_C0-3 (AE12, AF13, AC15, AE18)
PCI_AD0-31
Table 5
PCI_ARB_EN (AE22)
Table
Section 7, “Clock Configuration
PCI_MODCK is a bit in the Hard Reset Configuration Word. It is not an input signal as it is in
the MPC8280 Family and MPC8260 Family.
Table
Table
Note 4 unchanged.
Table
Table
of note 1.
Table
Table
Table
to both CS5 and GND. AD8 is only assigned to CS5.
Table
Table 22. Document Revision History (continued)
1: New
2: New
4: Modification of VDD and VCCSYN to 1.45–1.60 V
5: Addition of note 2 regarding TRST and PORESET (see V
6: Addition of R
20: Addition of note 2 to TRST (E21) and PORESET (C24)
20: Removal of Thermal0 (D19) and Thermal1(J3). These pins are now “No connects.”
20: Removal of Spare0 (AD24). This pin is now a “No connect.” Note 5 unchanged.
20: Addition of PCI_MODE (AD22). This pin was previously listed as “Ground.” Addition
5: Addition of note 2 to V
5: Changed I
20: Addition of ball AD9 to GND. In rev 0 of this document, AD8 was listed as assigned
20: Addition of note 4 to Thermal0 (D19) and Thermal1(J3)
and
and
and
Table
Table
Table
20: Modification of PCI signal names for consistency with PCI signal names
20: Addition of muxed signals
20: Corrected assertion level (added “ “) PCI_HOST_EN (AC21) and
OL
θJT
for 60x signals to 6.0 mA
and note 4
Table
IH
16,
Modes”: Modification to first paragraph. Note that
Figure 15
Substantive Changes
Table
17,
Table
18, and
Table 19
IH
row of
Document Revision History
Table
5)
59