MPC860TCZQ50D4 Freescale Semiconductor, MPC860TCZQ50D4 Datasheet - Page 74

IC MPU POWERQUICC 50MHZ 357PBGA

MPC860TCZQ50D4

Manufacturer Part Number
MPC860TCZQ50D4
Description
IC MPU POWERQUICC 50MHZ 357PBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC Ir
Datasheet

Specifications of MPC860TCZQ50D4

Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
50MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Core Size
32 Bit
Program Memory Size
8KB
Cpu Speed
50MHz
Embedded Interface Type
Ethernet, I2C, SPI, UART
Digital Ic Case Style
BGA
No. Of Pins
357
Rohs Compliant
No
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.465/3.6V
Operating Supply Voltage (min)
2/3.135V
Operating Temp Range
-40C to 95C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC860TCZQ50D4
Manufacturer:
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Quantity:
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Part Number:
MPC860TCZQ50D4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC860TCZQ50D4
Manufacturer:
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Quantity:
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Mechanical Data and Ordering Information
14.2
Figure 77
74
Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the ZP PBGA Package
Mechanical Dimensions of the PBGA Package
W
M
shows the mechanical dimensions of the ZP PBGA package.
V
U
R
P
N
K
H
G
E
D
C
B
A
T
L
J
F
1
E2
2
1.
2.
3.
3
4
5
BOTTOM VIEW
Dimensions and tolerance per ASME Y14.5M, 1994.
Dimensions in millimeters.
Dimension b is the maximum solder ball diameter measured parallel
to data C.
6
7
8
9
10
D1
11
TOP VIEW
12
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
13
14
D2
D
15
16
17
18
19
NOTE
4X
357X
E1
18X
0.15 M C
0.3 M C
E
B
0.2
b
A
e
A B
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
E
b
e
0.35 C
0.2 C
0.25 C
22.40
22.40
MILLIMETERS
MIN
0.50
0.95
0.70
0.60
A2
A3
25.00 BSC
22.86 BSC
25.00 BSC
22.86 BSC
1.27 BSC
---
A1
SIDE VIEW
22.60
22.60
A
MAX
2.05
0.70
1.35
0.90
0.90
C
Freescale Semiconductor

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