MPC8260AZUMHBB Freescale Semiconductor, MPC8260AZUMHBB Datasheet - Page 34
![IC MPU POWERQUICC II 480-TBGA](/photos/6/77/67722/mfg_mpc8260_series_sml.jpg)
MPC8260AZUMHBB
Manufacturer Part Number
MPC8260AZUMHBB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Specifications of MPC8260AZUMHBB
Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
266MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Processor Series
MPC8xxx
Core
603e
Data Bus Width
32 bit
Maximum Clock Frequency
266 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
No
Rohs Compliant
No
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8260AZUMHBB
Manufacturer:
MOTOROLA
Quantity:
490
Company:
Part Number:
MPC8260AZUMHBB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8260AZUMHBB
Manufacturer:
FREE
Quantity:
20 000
Pinout
Figure 14
Table 21
Table
Symbols used in
34
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
OVERBAR
UTM
UTS
UT8
UT16
MII
21.
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
shows the pinout list of the MPC826xA.
shows the side profile of the TBGA package to indicate the direction of the top surface view.
Soldermask
1.27 mm Pitch
Table 21
Polymide Tape
Symbol
are described in
(Oxidized for Insulation)
Copper Heat Spreader
Pin Name
Figure 14. Side View of the TBGA Package
Table 20. Symbol Legend
Glob-Top Dam
Table 21. Pinout List
Table
Signals with overbars, such as TA, are active low.
Indicates that a signal is part of the UTOPIA master interface.
Indicates that a signal is part of the UTOPIA slave interface.
Indicates that a signal is part of the 8-bit UTOPIA interface.
Indicates that a signal is part of the 16-bit UTOPIA interface.
Indicates that a signal is part of the media independent interface.
20.
Glob-Top Filled Area
Table 20
View
Die
Wire Bonds
defines conventions and acronyms used in
Attach
Die
Meaning
W5
F4
E2
E3
G1
H5
H2
H1
J5
J4
J3
J2
Copper Traces
Cavity
Etched
Pressure Sensitive
Ball
Adhesive
Freescale Semiconductor