MPC8260AZUMHBB Freescale Semiconductor, MPC8260AZUMHBB Datasheet - Page 47
MPC8260AZUMHBB
Manufacturer Part Number
MPC8260AZUMHBB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Specifications of MPC8260AZUMHBB
Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
266MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Processor Series
MPC8xxx
Core
603e
Data Bus Width
32 bit
Maximum Clock Frequency
266 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
No
Rohs Compliant
No
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8260AZUMHBB
Manufacturer:
MOTOROLA
Quantity:
490
Company:
Part Number:
MPC8260AZUMHBB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8260AZUMHBB
Manufacturer:
FREE
Quantity:
20 000
5.2
Figure 15
package.
Freescale Semiconductor
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
Mechanical Dimensions
provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel
to primary data A.
A
A1
A2
A3
b
D
D1
e
E
E1
Dim
1.45
0.60
0.85
0.25
0.65
37.50 BSC
35.56 REF
1.27 BSC
37.50 BSC
35.56 REF
Millimeters
Min
Package Description
1.65
0.70
0.95
—
0.85
Max
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