MPC8347EVVALFB Freescale Semiconductor, MPC8347EVVALFB Datasheet - Page 18

• Manufacturer Part Number: MPC8347EVVALFB
• Description: IC MPU POWERQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8347EVVALFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 667 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.36V
• Operating Supply Voltage (min): 1.24V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: TBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

DDR SDRAM
Figure 5
Figure 6
18
At recommended operating conditions with GV
MDQS epilogue end
Notes:
1. The symbols used for timing specifications follow the pattern of t
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. In the source synchronous mode, MCK/MCK can be shifted in 1/4 applied cycle increments through the clock control register.
4. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. For the
5. Note that t
6. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
7. All outputs are referenced to the rising edge of MCK(n) at the pins of the MPC8347E. Note that t
inputs and t
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
t
(A) are setup (S) or output valid time. Also, t
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
For the skew measurements referenced for t
address/command valid with the rising edge of MCK.
ADDR/CMD setup and hold specifications, it is assumed that the clock control register is set to adjust the memory clocks by
1/2 applied cycle.
from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). t
of the DQSS override bits in the TIMING_CFG_2 register. In source synchronous mode, this will typically be set to the same
delay as the clock adjust in the CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters
have been set to the same adjustment value. See the MPC8349E PowerQUICC™ II Pro Integrated Host Processor Family
Reference Manual , for a description and understanding of the timing modifications enabled by use of these bits.
(MECC), or data mask (MDM). The data strobe should be centered inside of the data eye at the pins of the MPC8347E.
conventions described in note 1.
DDKHAS
Table 14. DDR SDRAM Output AC Timing Specifications for Source Synchronous Mode (continued)
shows the DDR SDRAM output timing for address skew with respect to any MCK.
provides the AC test load for the DDR bus.
symbolizes DDR timing (DD) for the time t
DDKHMH
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
(first two letters of functional block)(reference)(state)(signal)(state)
Parameter
follows the symbol conventions described in note 1. For example, t
Figure 5. Timing Diagram for t
ADDR/CMD
ADDR/CMD
MCK[n]
MCK[n]
DD
of 2.5 V ± 5%.
DDKLDX
AOSKEW
Symbol
t
DDKLME
MCK
symbolizes DDR timing (DD) for the time t
it is assumed that the clock adjustment is set to align the
memory clock reference (K) goes from the high (H) state until outputs
1
t
CMD
AOSKEW(min)
t
AOSKEWmax)
CMD
t
(first two letters of functional block)(signal)(state)(reference)(state)
MCK
for outputs. Output hold time can be read as DDR timing
AOSKEW
Min
-0.9
NOOP
Measurement
NOOP
DDKHMH
DDKHMH
Max
0.3
can be modified through control
describes the DDR timing (DD)
MCK
DDKHMP
Freescale Semiconductor
memory clock reference
follows the symbol
Unit
ns
Notes
for
7