TSPC603RVGH10LC Atmel, TSPC603RVGH10LC Datasheet - Page 47
TSPC603RVGH10LC
Manufacturer Part Number
TSPC603RVGH10LC
Description
IC MPU 32BIT 10MHZ 255CBGA
Manufacturer
Atmel
Datasheet
1.TSPC603RVA8LC.pdf
(58 pages)
Specifications of TSPC603RVGH10LC
Processor Type
PowerPC 603e 32-Bit RISC
Speed
233MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
255-CBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
15. Package Mechanical Data
15.1
5410B–HIREL–09/05
HiTCE CBGA Package Parameters
The following sections provide the package parameters and mechanical dimensions for the
CBGA, HiTCE CBGA and the Cerquad packages.
The package parameters are as provided in the following list. The package type is 21 mm, 255-
lead HiTCE Ceramic Ball Array (HiTCE CBGA).
Package outline
Interconnects
Pitch
Maximum module height
255
1.27 mm
21 mm × 21 mm
3.08 mm
TSPC603R
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