TSPC603RVGH10LC Atmel, TSPC603RVGH10LC Datasheet - Page 50
TSPC603RVGH10LC
Manufacturer Part Number
TSPC603RVGH10LC
Description
IC MPU 32BIT 10MHZ 255CBGA
Manufacturer
Atmel
Datasheet
1.TSPC603RVA8LC.pdf
(58 pages)
Specifications of TSPC603RVGH10LC
Processor Type
PowerPC 603e 32-Bit RISC
Speed
233MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
255-CBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
15.3
15.3.1
50
CI-CGA Package Parameters
TSPC603R
Mechanical Dimensions of the CI-CGA Package
The package parameters are as provided in the following list. The package type is 21 mm,
255-lead ceramic ball grid array (CI-CGA).
Figure 15-3
CGA package.
Package outline
Interconnects
Pitch
Typical module height
provides the mechanical dimensions and bottom surface nomenclature of the CI-
255
1.27 mm
21 mm × 21 mm
3.84 mm
5410B–HIREL–09/05