A80960KB25 Intel, A80960KB25 Datasheet - Page 3

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A80960KB25

Manufacturer Part Number
A80960KB25
Description
IC MPU I960KB 25MHZ 132-PGA
Manufacturer
Intel
Datasheet

Specifications of A80960KB25

Processor Type
i960
Features
KB suffix, 32-Bit, 512 Byte Cache
Speed
25MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
132-PGA
Family Name
i960
Device Core Size
32b
Frequency (max)
25MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
5V
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
4.75V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Through Hole
Pin Count
132
Package Type
PGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
803535

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
A80960KB25
Manufacturer:
INTEL
Quantity:
1 034
1.0 THE i960® PROCESSOR .......................................................................................................................... 1
2.0 ELECTRICAL SPECIFICATIONS ............................................................................................................ 10
3.0 MECHANICAL DATA ................................................................................................................................ 21
4.0 WAVEFORMS .......................................................................................................................................... 33
5.0 REVISION HISTORY ............................................................................................................................... 38
iii
1.1 Key Performance Features ................................................................................................................. 2
2.1 Power and Grounding ....................................................................................................................... 10
2.2 Power Decoupling Recommendations ............................................................................................. 10
2.3 Connection Recommendations ........................................................................................................ 11
2.4 Characteristic Curves ....................................................................................................................... 11
2.5 Test Load Circuit ............................................................................................................................... 14
2.7 DC Characteristics ............................................................................................................................ 15
2.6 Absolute Maximum Ratings .............................................................................................................. 15
2.8 AC Specifications ............................................................................................................................. 16
3.1 Packaging ......................................................................................................................................... 21
3.2 Pinout ............................................................................................................................................... 25
3.3 Package Thermal Specification ........................................................................................................ 29
1.1.1 Memory Space And Addressing Modes ................................................................................... 4
1.1.2 Data Types ............................................................................................................................... 4
1.1.3 Large Register Set ................................................................................................................... 4
1.1.4 Multiple Register Sets .............................................................................................................. 5
1.1.5 Instruction Cache ..................................................................................................................... 5
1.1.6 Register Scoreboarding ........................................................................................................... 5
1.1.7 High Bandwidth Local Bus ....................................................................................................... 6
1.1.8 Interrupt Handling .................................................................................................................... 6
1.1.9 Debug Features ....................................................................................................................... 6
1.1.10 Fault Detection ....................................................................................................................... 7
1.1.11 Built-in Testability ................................................................................................................... 7
2.8.1 AC Specification Tables ......................................................................................................... 17
3.1.1 Pin Assignment ...................................................................................................................... 21
EMBEDDED 32-BIT MICROPROCESSOR
80960KB
Contents

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