MPC7410RX500LE Freescale Semiconductor, MPC7410RX500LE Datasheet - Page 37

• Manufacturer Part Number: MPC7410RX500LE
• Description: IC MPU 32BIT 500MHZ PPC 360-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC7410RX500LE

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 500MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

existing designs should qualify both AV
be implemented.
The filter circuit should be placed as close as possible to the AV
circuits. A separate circuit should be placed as close as possible to the L2AV
directly from the capacitors to the AV
inductance of vias. The L2AV
It is the recommendation of Freescale, that systems that implement the AV
pads for the removed capacitors (shown in
Figure
package of the MPC7410.
8.3 Decoupling Recommendations
Due to the MPC7410 dynamic power management feature, large address and data buses, and high operating
frequencies, the MPC7410 can generate transient power surges and high frequency noise in its power supply,
especially while driving large capacitive loads. This noise must be prevented from reaching other components in the
MPC7410 system, and the MPC7410 itself requires a clean, tightly regulated source of power. Therefore, it is
recommended that the system designer place at least one decoupling capacitor at each V
pin of the MPC7410. It is also recommended that these decoupling capacitors receive their power from separate
V
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology) capacitors
should be used to minimize lead inductance, preferably 0508 or 0603 orientations, where connections are made
along the length of the part.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the
V
should have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should
also be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk
capacitors—100–330 µF (AVX TPS tantalum or Sanyo OSCON).
Freescale Semiconductor
DD
DD
, (L2)OV
, L2OV
21. This would be necessary in case there is a planned transition from the CBGA package to the HCTE
DD
DD
, and OV
, and GND power planes in the PCB, utilizing short traces to minimize inductance.
V
DD
DD
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors
V
DD
DD
Figure 22. PLL Power Supply Filter Circuit No. 2
Figure 21. PLL Power Supply Filter Circuit No.1
pin may be more difficult to route, but is proportionately less critical.
10 Ω
DD
DD
51 Ω
pin, which is on the periphery of the 360 BGA footprint, without the
Figure
filter solutions, and the filter providing the most robust margin should
2.2 µF
21), to provide for the possible reintroduction of the filter in
GND
Low ESL Surface Mount Capacitors
GND
2.2 µF
DD
pin to minimize noise coupled from nearby
Capacitor
Pad Sites
AV
DD
DD
DD
filter shown in
(or L2AV
pin. It is often possible to route
AV
DD
DD
System Design Information
DD
)
, OV
Figure 22
DD
, and L2OV
design in the
DD
37