PKB4110CPI Ericsson Power Modules, PKB4110CPI Datasheet - Page 2

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PKB4110CPI

Manufacturer Part Number
PKB4110CPI
Description
DC/DC Converters & Regulators 3.3Vdc 40A Isolated Input 36-75V 132W
Manufacturer
Ericsson Power Modules
Series
PKB-Cr
Datasheet

Specifications of PKB4110CPI

Product
Isolated
Output Power
132 W
Input Voltage Range
36 V to 75 V
Number Of Outputs
1
Output Voltage (channel 1)
3.3 V
Output Current (channel 1)
40 A
Isolation Voltage
2.25 KV
Package / Case Size
Eighth Brick
Output Type
Isolated
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PKB4110CPI
Manufacturer:
MSTAR
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Part Number:
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Manufacturer:
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Part Number:
PKB4110CPILVLHSLA
Manufacturer:
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Part Number:
PKB4110CPIMLA
Manufacturer:
ERICSSON/爱立信
Quantity:
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Part Number:
PKB4110CPIP
Manufacturer:
ERICSSON/爱立信
Quantity:
20 000
E
Prepared (also subject responsible if other)
EWEIXIE
Approved
SEC/D (Julia You)
PKB4000C series
DC/DC converters, Input 36-75 V, Output 60A/144W
General Information
Ordering Information
See Contents for individual product ordering numbers.
Option
Surface mount
Positive Remote Control Logic
Latching OCP
Latching OTP
Latching OVP
Latching OTP and OVP
Latching OCP and OTP
Latching OCP and OVP
All protection features latching
Increased Stand-off height
Lead length 3.69 mm (0.145 in)
Lead length 4.57 mm (0.180 In)
Baseplate
Note: As an example a positive logic, short pin, lathing OVP, baseplate
product would be PKB 4110C PIPLVHSLA.
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (T
+40°C, which is a typical condition in Information and
Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses Telcordia SR332.
Predicted MTBF for the series is:
-
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
1 million hours according to Telcordia SR332, issue 1,
Black box technique.
Suffix
SI
P
LI
LT
LV
LP
LIT
LIV
LPA
M
LA
LB
HS
Ordering No.
PKB 4110C SI
PKB 4110C PIP
PKB 4110C PILI
PKB 4110C PILT
PKB 4110C PILV
PKB 4110C PILP
PKB 4110C PILIT
PKB 4110C PILIV
PKB 4110C PILPA
PKB 4110C PIM
PKB 4110C PILA
PKB 4110C PILB
PKB 4110C PIHS
Checked
MICMROS
A
) of
Ericsson Internal
PRODUCT SPECIFICATION
No.
1/1301- BMR 655 Uen
Date
2008-5-23
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
-
-
-
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Technical Specification
EN/LZT 146 377 R3H
© Ericsson AB
Rev
C
Reference
Feb 2009
2 (4)
2

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