HIN202CBZ Intersil, HIN202CBZ Datasheet - Page 18

IC TXRX RS-232 5V 16-SOIC

HIN202CBZ

Manufacturer Part Number
HIN202CBZ
Description
IC TXRX RS-232 5V 16-SOIC
Manufacturer
Intersil
Type
Transceiverr
Datasheet

Specifications of HIN202CBZ

Number Of Drivers/receivers
2/2
Protocol
RS232
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.5mm Width)
Device Type
Transceiver
Interface Type
RS232
No. Of Drivers
2
Supply Voltage Range
4.5V To 5.5V
Driver Case Style
SOIC
No. Of Pins
16
Operating Temperature Range
0°C To +70°C
Svhc
No SVHC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HIN202CBZ
Manufacturer:
Intersil
Quantity:
1 716
Part Number:
HIN202CBZ
Manufacturer:
Clare
Quantity:
1 807
Part Number:
HIN202CBZ-T
Manufacturer:
Intersil
Quantity:
4 000
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. In-
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
sions are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
18
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
H
A1
µ
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
M28.3
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AE ISSUE C)
0.0926
0.0040
0.013
0.0091
0.6969
0.2914
0.394
0.01
0.016
MIN
0
o
0.05 BSC
INCHES
28
0.1043
0.0118
0.0200
0.0125
0.7125
0.2992
0.419
0.029
0.050
MAX
8
o
17.70
10.00
MILLIMETERS
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MIN
0
o
1.27 BSC
28
18.10
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
8
o
Rev. 0 12/93
NOTES
9
3
4
5
6
7
-
-
-
-
-
-

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