ICL3225EIA Intersil, ICL3225EIA Datasheet - Page 18
![IC TXRX RS-232 3-5.5V ESD 20SSOP](/photos/6/84/68480/20-20-ssop_sml.jpg)
ICL3225EIA
Manufacturer Part Number
ICL3225EIA
Description
IC TXRX RS-232 3-5.5V ESD 20SSOP
Manufacturer
Intersil
Type
Transceiverr
Datasheet
1.ICL3225ECAZ-T.pdf
(20 pages)
Specifications of ICL3225EIA
Number Of Drivers/receivers
2/2
Protocol
RS232
Voltage - Supply
3 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
20-SSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ICL3225EIAZ
Manufacturer:
INTERSIL
Quantity:
20 000
Company:
Part Number:
ICL3225EIAZ-T
Manufacturer:
INFINEON
Quantity:
101
Company:
Part Number:
ICL3225EIAZ-T
Manufacturer:
MIT
Quantity:
6 219
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
N
1. Symbols are defined in the “MO Series Symbol List” in Section
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. In-
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
1
2.2 of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
terlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
index feature must be located within the crosshatched area.
dambar protrusion shall be 0.13mm (0.005 inch) total in excess
of “B” dimension at maximum material condition.
sions are not necessarily exact.
0.25(0.010)
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
18
H
A1
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
ICL3225E, ICL3227E, ICL3245E
0.010
A2
M
0.25
B
M
L
C
M20.209
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
A
B
C
D
E
H
N
α
e
L
(JEDEC MO-150-AE ISSUE B)
0 deg.
0.068
0.002
0.066
0.010’
0.004
0.278
0.205
0.301
0.025
MIN
0.026 BSC
INCHES
20
8 deg.
0.078
0.008’
0.070’
0.015
0.008
0.289
0.212
0.311
0.037
MAX
0 deg.
1.73
0.05
1.68
0.25
0.09
7.07
5.20’
7.65
0.63
MIN
MILLIMETERS
0.65 BSC
20
8 deg.
1.99
0.21
1.78
0.38
0.20’
7.33
5.38
7.90’
0.95
MAX
February 27, 2006
Rev. 3 11/02
NOTES
FN4900.9
9
3
4
6
7