CL21B682KBNC Samsung Electro-Mechanics, CL21B682KBNC Datasheet - Page 24

• Manufacturer Part Number: CL21B682KBNC
• Description: Capacitor, Multilayer Ceramic; 6800pF; Chip; Case 0805; +/-10%; 50VDC; SMD; X7R; 2mm
• Manufacturer: Samsung Electro-Mechanics

Specifications of CL21B682KBNC

• Brand/series: CL Series
• Capacitance: 6800 pF
• Case Code: 0805
• Insulation Resistance: 10000 Megohms
• Length: 2.0 mm ± 0.1 mm mm
• Material, Element: Ceramic
• Package Type: 0805
• Temperature Coefficient: 0 ± 30 ppm⁄°C
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -55 °C
• Termination: SMT
• Thickness: 1.25 mm ± 0.1 mm (Max.)
• Tolerance: ±10 %
• Voltage, Rating: 50 VDC
• Width: 1.25 mm ± 0.1 mm mm

■ APPLICATION MANUAL
Multilayer Ceramic Capacitor
● Storage Condition
▶ Storage Environment
▶ Corrosive Gases
▶ Temperature Fluctuations
● Design of Land Pattern
● Adhesives
▶ Requirements for Adhesives
The electrical characteristics of MLCCs were degraded by the environment of high temperature
or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative
humidity of less than 40 ℃ and 70%, respectively. Guaranteed storage period is within 6 months
from the outgoing date of delivery.
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
Since dew condensation may occur by the differences in temperature when the MLCCs are
taken out of storage, it is important to maintain the temperature-controlled environment.
When designing printed circuit boards, the shape and size of the lands must allow for the
proper amount of solder on the capacitor. The amount of solder at the end terminations has a
direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which
was due to too much amount of solder. In contrast, if too little solder is applied, the termination
strength will be insufficiently. Use the following illustrations as guidelines for proper land design.
When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.
They must have enough adhesion, so that, the chips will not fall off or move during the
handling of the circuit board.
They must maintain their adhesive strength when exposed to soldering temperature.
They should not spread or run when applied to the circuit board.
They should harden quickly.
They should not corrode the circuit board or chip material.
Recommendation of Land Shape and Size
Solder
Land
2/3W < b < W
W
Solder Resist
b
a
T
2/3T < a < T
Solder Resist
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