CL21B682KBNC Samsung Electro-Mechanics, CL21B682KBNC Datasheet - Page 27

• Manufacturer Part Number: CL21B682KBNC
• Description: Capacitor, Multilayer Ceramic; 6800pF; Chip; Case 0805; +/-10%; 50VDC; SMD; X7R; 2mm
• Manufacturer: Samsung Electro-Mechanics

Specifications of CL21B682KBNC

• Brand/series: CL Series
• Capacitance: 6800 pF
• Case Code: 0805
• Insulation Resistance: 10000 Megohms
• Length: 2.0 mm ± 0.1 mm mm
• Material, Element: Ceramic
• Package Type: 0805
• Temperature Coefficient: 0 ± 30 ppm⁄°C
• Temperature, Operating, Maximum: 125 °C
• Temperature, Operating, Minimum: -55 °C
• Termination: SMT
• Thickness: 1.25 mm ± 0.1 mm (Max.)
• Tolerance: ±10 %
• Voltage, Rating: 50 VDC
• Width: 1.25 mm ± 0.1 mm mm

Multilayer Ceramic Capacitor
▶ Amount of Solder
▶ Cooling
▶ Notes for Separating Multiple, Shared PC Boards.
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning,
the temperature difference( △ T) must be less than 100 ℃
6-6. Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used,
chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip
capacitors. This means that the cleaning fluid must be carefully selected, and should always
be new.
A multi-PC board is separated into many individual circuit boards after soldering has been
completed. If the board is bent or distorted at the time of separation, cracks may occur in the
chip capacitors. Carefully choose a separation method that minimizes the bending of the
circuit board.
Not enough
Too much
Good
Solder
Solder
Cracks tend to occur due
to large stress
Weak holding force may
cause bad connections or
detaching of the capacitor
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