PIC16F631-I/P Microchip Technology Inc., PIC16F631-I/P Datasheet - Page 238

• Manufacturer Part Number: PIC16F631-I/P
• Description: MCU, 8-Bit, 1KW Flash, 64 RAM, 18 I/O, PDIP-20
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F631-I/P

• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 128 Bytes
• Input Output: 18
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 20-pin PDIP
• Programmable Memory: 1.75K Bytes
• Ram Size: 64 Bytes
• Speed: 20 MHz
• Timers: 1-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC16F631/677/685/687/689/690
17.5
DS41262D-page 236
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power.
DD
JA
JC
A
DIE
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
108.1
62.4
85.2
28.1
24.2
32.2
Typ
150
2.5
40
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
© 2007 Microchip Technology Inc.
* V
DD
Conditions
OL
(T
+ P
x V
) + Σ (I
DIE
I
DD
/
O
- T
A
OH
)/θ
* (V
JA
DD
- V
OH
))