25LC160-I/SN Microchip Technology Inc., 25LC160-I/SN Datasheet - Page 4

• Manufacturer Part Number: 25LC160-I/SN
• Description: 16K, 2K X 8 , 2.5V SER EE IND
• Manufacturer: Microchip Technology Inc.

Specifications of 25LC160-I/SN

• Capacitance, Input: 7 pF
• Capacitance, Output: 7 pF
• Current, Input, Leakage: ±10 μA
• Current, Operating: 1 mA (Read), 5 mA (Write)
• Current, Output, Leakage: ±10
• Data Retention: >200 yrs.
• Density: 16K
• Interface: SPI Bus
• Memory Type: Serial EEPROM
• Organization: 2048×8
• Package Type: SOIC
• Temperature, Operating: -40 to +85 °C
• Time, Access: 150 ns
• Time, Address Hold: 250
• Time, Address Setup: 250
• Time, Fall: 2 μs
• Time, Rise: 2 μs
• Voltage, Esd: >4 kV
• Voltage, Input, High: 3.5 V
• Voltage, Input, Low: 0.75 V
• Voltage, Output, High: 2 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

25AA160/25LC160/25C160
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
DS21231D-page 14
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
Dimension Limits
E1
E
Units
A2
A1
E1
E
D
B
n
p
A
h
L
c
MIN
h
.053
.052
.004
.228
.146
.189
.010
.019
.008
.013
2
1
0
0
0
L
D
INCHES*
NOM
.050
.056
.007
.237
.154
.193
.015
.025
.009
.017
.061
12
12
8
4
A
A1
MAX
.069
.010
.244
.157
.197
.020
.030
.010
.020
.061
15
15
8
MIN
1.35
1.32
0.10
5.79
4.80
0.25
0.48
0.20
0.33
3.71
0
0
0
MILLIMETERS
 2004 Microchip Technology Inc.
NOM
1.27
1.55
1.42
0.18
6.02
4.90
0.38
0.62
0.23
0.42
3.91
12
12
8
4
MAX
A2
1.75
1.55
0.25
6.20
3.99
5.00
0.76
0.25
0.51
0.51
15
15
8