25LC160-I/SN Microchip Technology Inc., 25LC160-I/SN Datasheet - Page 5

• Manufacturer Part Number: 25LC160-I/SN
• Description: 16K, 2K X 8 , 2.5V SER EE IND
• Manufacturer: Microchip Technology Inc.

Specifications of 25LC160-I/SN

• Capacitance, Input: 7 pF
• Capacitance, Output: 7 pF
• Current, Input, Leakage: ±10 μA
• Current, Operating: 1 mA (Read), 5 mA (Write)
• Current, Output, Leakage: ±10
• Data Retention: >200 yrs.
• Density: 16K
• Interface: SPI Bus
• Memory Type: Serial EEPROM
• Organization: 2048×8
• Package Type: SOIC
• Temperature, Operating: -40 to +85 °C
• Time, Access: 150 ns
• Time, Address Hold: 250
• Time, Address Setup: 250
• Time, Fall: 2 μs
• Time, Rise: 2 μs
• Voltage, Esd: >4 kV
• Voltage, Input, High: 3.5 V
• Voltage, Input, Low: 0.75 V
• Voltage, Output, High: 2 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2004 Microchip Technology Inc.
Device
Temperature Range
Package
PART NO.
Device
Temperature
25AA160: 16 Kbit 1.8V SPI Serial EEPROM
25AA160T: 16 Kbit 1.8V SPI Serial EEPROM (Tape and Reel)
25LC160: 16 Kbit 2.5V SPI Serial EEPROM
25LC160T: 16 Kbit 2.5V SPI Serial EEPROM (Tape and Reel)
25C160: 16 Kbit 5.0V SPI Serial EEPROM
25C160T: 16 Kbit 5.0V SPI Serial EEPROM (Tape and Reel)
I
E
P
SN
Range
X
= -40 C to
= -40 C to +125 C
=
=
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
Package
/XX
+85 C
Pattern
XXX
25AA160/25LC160/25C160
Examples:
a)
b)
c)
d)
e)
f)
25AA160-I/P: Industrial Temp.,
PDIP package
25AA160-I/SN: Industrial Temp.,
SOIC package
25LC160-I/SN: Industrial Temp.,
SOIC package
25LC160T-I/SN: Tape and Reel,
Industrial Temp., SOIC package
25C160-E/P: Extended Temp.,
PDIP package
25C160-E/SN: Extended Temp.,
SOIC package
.
DS21231D-page 19