PIC32MX440F512HT-80V/PT Microchip Technology, PIC32MX440F512HT-80V/PT Datasheet - Page 153

• Manufacturer Part Number: PIC32MX440F512HT-80V/PT
• Description: 512 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 64 TQFP 10x10x1mm T/R
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX440F512HT-80V/PT

• Core Processor: MIPS32® M4K™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-TQFP
• Core: MIPS
• Processor Series: PIC32MX4xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 80 MHz
• Data Ram Size: 32 KB
• Number Of Programmable I/os: 5
• Number Of Timers: 5
• Operating Supply Voltage: 2.3 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Mounting Style: SMD/SMT
• Interface Type: USB, I2C, UART, RS-232, RS-485, SPI
• Maximum Operating Temperature: + 105 C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TABLE 29-5:
© 2011 Microchip Technology Inc.
DC CHARACTERISTICS
Operating Current (I
DC20
DC20c
DC21
DC21c
DC22
DC22c
DC23
DC23c
DC24
DC24a
DC24b
DC24c
DC25
DC25a
DC25b
DC25d
DC25c
DC26
DC26a
DC26b
DC26c
Note 1:
Param.
No.
2:
3:
4:
A device’s I
such as PBCLK (Peripheral Bus Clock) frequency, number of peripheral modules enabled, internal code
execution pattern, execution from program Flash memory vs. SRAM, I/O pin loading and switching rate,
oscillator type as well as temperature can have an impact on the current consumption.
The test conditions for I
external square wave from rail to rail and PBCLK divisor = 1:8. CPU, Program Flash and SRAM data
memory are operational, Program Flash memory Wait states = 7, program cache and prefetch are dis-
abled and SRAM data memory Wait states = 1. All peripheral modules are disabled (ON bit = 0). WDT
and FSCM are disabled. All I/O pins are configured as inputs and pulled to V
Data in “Typical” column is at 3.3V, 25°C at specified operating frequency unless otherwise stated.
Parameters are for design guidance only and are not tested.
This parameter is characterized, but not tested in manufacturing.
Typical
23.5
16.4
125
302
400
8.5
4.0
48
45
55
60
55
94
71
—
—
—
—
—
—
—
—
9
DC CHARACTERISTICS: OPERATING CURRENT (I
(3)
DD
DD
)
(1,2)
supply current is mainly a function of the operating voltage and frequency. Other factors,
Max.
100
100
130
670
850
180
700
900
110
13
15
32
61
75
—
—
—
—
—
—
—
—
—
DD
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
Units
mA
mA
mA
mA
mA
mA
mA
mA
measurements are as follows: Oscillator mode = EC+PLL with OSC1 driven by
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from Flash
Code executing from SRAM
Code executing from SRAM
—
—
—
—
—
—
—
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
PIC32MX3XX/4XX
Conditions
DD
+105ºC
+105ºC
+105ºC
+105ºC
+105ºC
+25ºC,
+25ºC,
-40ºC,
+85ºC
-40ºC,
+85ºC
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
—
—
—
—
—
)
SS
. MCLR = V
2.3V
2.3V
3.3V
3.6V
—
—
—
—
—
DS61143H-page 153
LPRC (31 kHz)
DD
(Note 4)
(Note 4)
(Note 4)
20 MHz
60 MHz
80 MHz
.
4 MHz