STM32L152R8H6 STMicroelectronics, STM32L152R8H6 Datasheet - Page 99
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STM32L152R8H6
Manufacturer Part Number
STM32L152R8H6
Description
16/32-BITS MICROS
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32L152-EVAL.pdf
(107 pages)
Specifications of STM32L152R8H6
Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
32MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 20x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFBGA
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32L152R8H6
Manufacturer:
TI
Quantity:
397
Company:
Part Number:
STM32L152R8H6
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32L151xx, STM32L152xx
Table 59.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
FD
A1
A2
D1
E1
FE
D
A
E
b
e
Figure 35. UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch,
1. Drawing is not to scale.
UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package
mechanical data
A1 ball
pad corner
0.46
0.06
Min
0.4
0.2
1.75
package outline
millimeters
1.75
Top view
D
0.53
0.08
0.45
0.25
0.75
0.75
Typ
5.5
5.5
0.5
7
7
Doc ID 17659 Rev 4
X
E
Y
Max
0.6
0.1
0.5
0.3
0.10
Side view
0.0181
0.0024
0.0157
0.0079
A
0.10
Min
A1
A2
Z
FD
inches
0.0209
0.0031
0.0177
0.0098
0.2756
0.2165
0.2756
0.2165
0.0197
0.0295
0.0295
Package characteristics
Typ
Bottom view
0.50
D1
(1)
0.0236
0.0039
0.0197
0.0118
Max
b
e
A0C2_ME
A1 ball
pad corner
FE
99/107
E1