C0510X6S0G224M TDK Corporation, C0510X6S0G224M Datasheet - Page 14

• Manufacturer Part Number: C0510X6S0G224M
• Description: CAP CER .22UF 4.0V X6S 20% 0204
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C0510X6S0G224M

• Capacitance: 0.22µF
• Voltage - Rated: 4V
• Tolerance: ±20%
• Temperature Coefficient: X6S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 105°C
• Applications: Bypass, Decoupling
• Ratings: -
• Package / Case: 0402 (1005 Metric) Wide, 0204 (0510 Metric)
• Size / Dimension: 0.020" L x 0.039" W (0.52mm x 1.00mm)
• Height: -
• Thickness: 0.014" (0.35mm)
• Lead Spacing: -
• Features: Low ESL (Reverse Geometry)
• Lead Style: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 445-7075-2

TDK MLCC US Catalog
Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
A
B
C
Type
Soldering
Information
B
C
[CC0204]
C0510
0.20
0.20
1.00
Chip capacitor
A
[CC0306]
C0816
0.30
0.35
1.60
Solder land
[CC0508]
C1220
Maximum amount
Minimum amount
0.50
0.55
2.00
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Solder resist
[CC0612]
Unit: mm
C1632
0.725
0.75
3.20
Peak
Temp
Page 208
0
C Series – Low ESL Flip Type
Over 60 sec.
∆T
• Recommended Soldering Profile
Preheating
Reflow Soldering
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Peak Temp time
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
Soldering
Soldering Natural
Temp./
cooling
Dura.
Peak temp
300
230 max.
260 max.
0
(°C)
Reflow Soldering
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
Manual soldering
∆T
(Solder iron)
Preheating
3sec. (As short as possible)
Duration
20 max.
10 max.
(sec.)
Version B11