MK20DX256ZVLK10 Freescale Semiconductor, MK20DX256ZVLK10 Datasheet - Page 21

KINETIS 256K USB

MK20DX256ZVLK10

Manufacturer Part Number
MK20DX256ZVLK10
Description
KINETIS 256K USB
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MK20DX256ZVLK10

Processor Series
K20
Core
ARM Cortex M4
Data Bus Width
16 bit
Program Memory Type
Flash
Program Memory Size
256 KB
Data Ram Size
128 KB
Interface Type
USB, CAN, SPI, I2C, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
2
Number Of Timers
2
Operating Supply Voltage
1.71 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Package / Case
LQFP-80
Operating Temperature Range
- 40 C to + 105 C
Processor To Be Evaluated
MK20DX256ZVLK10
Supply Current (max)
185 mA
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MK20DX256ZVLK10
Manufacturer:
FREESCALE
Quantity:
210
Part Number:
MK20DX256ZVLK10
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MK20DX256ZVLK10
Manufacturer:
FREESCALE
Quantity:
20 000
5.4.1 Thermal operating requirements
5.4.2 Thermal attributes
1.
2.
Freescale Semiconductor, Inc.
Single-layer
(1s)
Four-layer
(2s2p)
Single-layer
(1s)
Four-layer
(2s2p)
Board type
Symbol
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
J
A
Die junction temperature
Ambient temperature
Description
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
K20 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Table 11. Thermal operating requirements
Thermal
resistance,
junction to
ambient (natural
convection)
Thermal
resistance,
junction to
ambient (natural
convection)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
board
Thermal
resistance,
junction to case
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
Description
65
36
52
31
17
13
3
81 MAPBGA
50
35
39
29
19
8
2
80 LQFP
Min.
–40
–40
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Max.
125
105
1
1
1
1
2
3
4
Notes
Unit
°C
°C
General
21

Related parts for MK20DX256ZVLK10