LLL153C80J224ME14E Murata Electronics North America, LLL153C80J224ME14E Datasheet - Page 199
LLL153C80J224ME14E
Manufacturer Part Number
LLL153C80J224ME14E
Description
CAP CER
Manufacturer
Murata Electronics North America
Series
LLLr
Datasheet
1.GNM1M2R71C104MA03D.pdf
(220 pages)
Specifications of LLL153C80J224ME14E
Capacitance
0.22µF
Voltage - Rated
6.3V
Tolerance
±20%
Temperature Coefficient
X6S
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 105°C
Applications
Bypass, Decoupling
Ratings
-
Package / Case
-
Size / Dimension
-
Height
-
Thickness
-
Lead Spacing
-
Features
Low ESL (Reverse Geometry)
Lead Style
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
LLL153C80J224ME14L
LLL153C80J224ME14L
LLL153C80J224ME14L
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LLL153C80J224ME14E
Manufacturer:
MURATA
Quantity:
640 000
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
*1 "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
*2 "C" expresses nominal capacitance value (pF).
No.
12
13
14
15
Continued from the preceding page.
Vibration
Resistance
Resistance
to Soldering
Heat
Deflection
Solderability of
Termination
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
D.F.
Q
Appearance
Capacitance
Change
I.R.
Dielectric
Strength
No defects or abnormalities
Within the specified tolerance
No cracking or marking defects should occur.
75% of the terminations are to be soldered evenly and continuously.
No marking defects
More than 1,000MΩ
In accordance with item No.4
Char.
Char.
X7R
X7R
SL
SL
4.5Z2.0
4.5Z3.2
5.7Z2.8
5.7Z5.0
LZW
(mm)
Within T2.5% or T0.25pF
(Whichever is larger)
QU400W20C*
QU1000
Capacitance Change
Specification
Within T10%
3.5
3.5
4.5
4.5
D.F.V0.025
a
d
Specifications
2
100
(CU30pF)
(CF30pF)
b
c
a
Fig. 2
Dimension (mm)
7.0
7.0
8.0
8.0
b
4.5
t : 1.6
2.4
3.7
3.2
5.6
c
GA3 Series Specifications and Test Methods
1.0
d
Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each of 3 mutually perpendicular
directions (total of 6 hrs.).
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3. The soldering
should be done using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
#Immersing speed: 25T2.5mm/s
#Pretreatment for X7R char.
*Preheating
Preheat the capacitor as table. Immerse the capacitor in solder
solution at 260T5D for 10T1 sec. Let sit at room condition*
24T2 hrs., then measure.
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition*
Step
1
2
235T5°C H60A or H63A Eutectic Solder
Glass Epoxy Board
R230
Capacitance meter
Temperature
100 to 120D
170 to 200D
45
Fig. 3
Test Method
20 50
45
Continued on the following page.
Pressurize
W00
Y10
Pressurizing
speed: 1.0mm/s
Flexure=1
D for 60T5 min. and then
1
.
Solder resist
Cu
(in mm)
1 min.
1 min.
Time
1
for
197
C02E.pdf
09.9.18
18
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