SI5100-F-BC Silicon Laboratories Inc, SI5100-F-BC Datasheet - Page 37
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SI5100-F-BC
Manufacturer Part Number
SI5100-F-BC
Description
IC TXRX SERIAL/DESERIAL 195CBGA
Manufacturer
Silicon Laboratories Inc
Type
Transceiverr
Series
SiPHY®r
Specifications of SI5100-F-BC
Package / Case
196-BGA
Number Of Drivers/receivers
1/1
Protocol
SONET/SDH
Voltage - Supply
1.71 V ~ 1.89 V
Mounting Type
Surface Mount
Product
RF / Wireless
Supply Voltage (max)
1.89 V, 3.47 V
Supply Voltage (min)
1.71 V
Supply Current
0.83 A
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 20 C
Mounting Style
SMD/SMT
Maximum Power Dissipation
1600 mW
Number Of Channels
1
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Other names
336-1135
SI5100-BC
SI5100-BC
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI5100-F-BC
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
20. 15x15 mm 195L CBGA Recommended PCB Layout
Notes:
Symbol
1. The Placement Courtyard is the minimum keep-out area required to assure assembly clearances.
2. Pad Diameter is Copper Defined (Non-Solder Mask Defined/NSMD).
3. OSP Surface Finish Recommended
4. Controlling dimension is millimeters.
5. Land Pad Dimensions comply with IPC-SM-782 guidelines.
6. Target solder paste volume per pad is 0.065 mm3 ± 0.010 mm3 (4000 mils3 ± 600 mils3).
7. Recommended stencil type is chemically etched stainless steel with circularly tapered apertures.
C
D
E
F
X
Recommended stencil aperture dimensions to achieve target solder paste volume are 0.191mm
thick x 0.68±0.01 mm diameter, with a 0.025 mm taper.
Placement Courtyard
Column Width
Pad Diameter
Row Height
Parameter
Pad Pitch
Placement Courtyard
16.00
0.64
Min
—
—
—
Rev. 1.1
Dimension
13.00 REF
13.00 REF
1.00 BSC
Nom
0.68
—
Max
0.72
—
—
—
—
Notes
2, 3
1
Si5100
37