MCP23009-E/SS Microchip Technology, MCP23009-E/SS Datasheet - Page 29

IC I/O EXPANDER I2C 8B 20SSOP

MCP23009-E/SS

Manufacturer Part Number
MCP23009-E/SS
Description
IC I/O EXPANDER I2C 8B 20SSOP
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP23009-E/SS

Package / Case
20-SSOP
Interface
I²C
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
3.4MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
Interface ICs
Propagation Delay Time
50 ns
Operating Supply Voltage
1.8 V to 5.5 V
Power Dissipation
700 mW
Operating Temperature Range
- 40 C to + 125 C
Input Voltage
1.8 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
10 MHz
Maximum Operating Frequency
3.4 MHz
Mounting Style
SMD/SMT
Output Current
200 mA
Output Voltage
0.6 V to 4.8 V
Chip Configuration
8 Bit
Bus Frequency
3.4MHz
Ic Interface Type
I2C
No. Of I/o's
8
Supply Voltage Range
1.8V To 5.5V
Digital Ic Case Style
SSOP
No. Of Pins
20
Interface Type
I2C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
2.0
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on RESET with respect to V
Voltage on all other pins with respect to V
Voltage on GPIO Pins: ................................................................................................................................. -0.6V to 5.5V
Total power dissipation (Note 1)...........................................................................................................................700 mW
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sunk by any Output pin (V
© 2009 Microchip Technology Inc.
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
ELECTRICAL CHARACTERISTICS
Power dissipation is calculated as follows:
Pdis = V
DD
with respect to V
DD
IK
OK
(V
x {I
DD
SS
I
(V
DD
< 0 or V
pin ..............................................................................................................................125 mA
O
pin ...........................................................................................................................200 mA
- ∑ I
< 0 or V
SS
OH
I
> V
......................................................................................................... -0.3V to +7.0V
SS
} + ∑ {(V
(†)
O
..................................................................................................... -0.3V to +14V
DD
> V
SS
)...................................................................................................................... ±20 mA
DD
(except V
DD
) .............................................................................................................. ±20 mA
-V
OH
DD
) x I
DD
= 1.8V) ..............................................................................10 mA
OH
and GPIOA/B) ..................................... -0.6V to (V
} + ∑(V
MCP23009/MCP23S09
OL
x I
OL
)
DS22121B-page 29
DD
+ 0.6V)

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