SI3050-E-FM Silicon Laboratories Inc, SI3050-E-FM Datasheet - Page 117

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SI3050-E-FM

Manufacturer Part Number
SI3050-E-FM
Description
IC VOICE DAA GCI/PCM/SPI 24-QFN
Manufacturer
Silicon Laboratories Inc
Series
-r
Datasheet

Specifications of SI3050-E-FM

Function
Data Access Arrangement (DAA)
Interface
GCI, PCM, SPI
Number Of Circuits
1
Voltage - Supply
3 V ~ 3.6 V
Current - Supply
8.5mA
Power (watts)
*
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
24-WFQFN Exposed Pad
Includes
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
13.1. PCB Land Pattern: Si3011/18/19 SOIC
Table 33. 16-Pin Small Outline Integrated Circuit (SOIC) PCB Land Pattern Dimensions
Figure 59. 16-Pin Small Outline Integrated Circuit (SOIC) PCB Land Pattern
Dimension
C1
E
X1
Y1
Notes:
 
1. This Land Pattern Design is based on IPC-7351 pattern
2. All feature sizes shown are at Maximum Material Condition
SOIC127P600X165-16N for Density Level B (Median Land
Protrusion).
(MMC) and a card fabrication tolerance of 0.05 mm is
assumed.
Pad Column Spacing
Pad Row Pitch
Pad Length
Pad Width
Feature
Rev. 1.4
Si3050 + Si3011/18/19
(mm)
5.40
1.27
0.60
1.55
117

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