EPC9003 EPC, EPC9003 Datasheet
EPC9003
Specifications of EPC9003
Related parts for EPC9003
EPC9003 Summary of contents
Page 1
... FR4 board. JA θ Q Total Gate Charge (V See http://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf for details Gate to Drain Charge GD EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 | Q Gate to Source Charge GS PRELIMINARY , while its lateral device structure DS(ON) and zero Q . The end result is a device that G ...
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... V – Drain to Source Voltage (V) DS Figure for Various Current DS(ON 2 – Gate to Source Voltage (V) GS EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 | 25˚ 0 125˚ TEST CONDITIONS V = 100 100 2 4.5 5 5.5 1.8 1.8 MIN ...
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... Figure 7: Reverse Drain-Source Characteristics 60 25˚C 125˚ 0.5 1 1.5 2 2.5 V – Source to Drain Voltage (V) SD Figure 9: Normalized Threshold Voltage vs Temperature - – Junction Temperature ( ˚ EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 | OSS ISS RSS 150 200 3 3.5 4 4.5 -20 .03 ...
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... Dimension (mm) c (note 2) f (note 2) DIE MARKINGS Die orientation dot Gate Pad solder bar is under this corner EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 | Normalized Maximum Transient Thermal Impedance Single Pulse Rectangular Pulse Duration, seconds ...
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... FET DATASHEET DIE OUTLINE f Solder Bar View Side View RECOMMENDED LAND PATTERN 1 (units in µm) 2 EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 | SEATING PLANE 600 600 X4 3554 250 250 X5 MICROMETERS DIM MIN Nominal A 3524 3554 7 B 1602 1632 ...