DC1297B Linear Technology, DC1297B Datasheet - Page 20

• Manufacturer Part Number: DC1297B
• Description: BOARD EVAL LTM4612
• Manufacturer: Linear Technology
• Series: µModuler

Specifications of DC1297B

• Design Resources: LTM4612 Spice Model LTM4612 Gerber Files DC1297B Design Files DC1297B Schematic
• Main Purpose: DC/DC, Step Down
• Outputs And Type: 1, Non-Isolated
• Power - Output: -
• Voltage - Output: 3.3V, 5V ,12V
• Current - Output: 5A
• Voltage - Input: 5 ~ 36 V
• Regulator Topology: Buck
• Frequency - Switching: 850kHz
• Board Type: Fully Populated
• Utilized Ic / Part: LTM4612
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

LTM4612
Safety Considerations
The LTM4612 modules do not provide isolation from V
to V
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure.
Layout Checklist/Example
The high integration of LTM4612 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
• Use large PCB copper areas for high current path, in-
• Place high frequency ceramic input and output capaci-
20
applicaTions inForMaTion
cluding V
PCB conduction loss and thermal stress.
tors next to the V
high frequency noise.
OUT
. There is no internal fuse. If required, a slow blow
IN
, PGND and V
D
, PGND and V
OUT
. It helps to minimize the
V
GND
V
OUT
IN
OUT
C
OUT
pins to minimize
C
IN
Figure 17. Recommended PCB Layout
C
OUT
C
IN
IN
• Place a dedicated power ground layer underneath the
• Use round corners for the PCB copper layer to minimize
• To minimize the EMI noise and reduce module thermal
• Do not put vias directly on pads.
• If vias are placed onto the pads, the the vias must be
• Interstitial via placement can also be used if necessary.
• Use a separated SGND ground copper area for com-
• Place one or more high frequency ceramic capacitors
Figure 17 gives a good example of the recommended
layout.
unit.
the radiated noise.
stress, use multiple vias for interconnection between
top layer and other power layers.
capped.
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
close to the connection into the system board.
4612 F17
SIGNAL
GND
4612fb