XCARD XC-1 XMOS, XCARD XC-1 Datasheet - Page 13

• Manufacturer Part Number: XCARD XC-1
• Description: BOARD DEV KIT XS1-G4
• Manufacturer: XMOS
• Series: XCore™r
• Type: MCUr

Specifications of XCARD XC-1

• Contents: Board, Cable
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: XS1-G4
• Other names: 880-1013

XS1-G4 144BGA Datasheet (3.5)
To ensure correct device operation, the VDDIO and OTP_VDDIO supplies should be
3.3 ESD Stress Voltage
3.4 Reset Timing
User code must wait for the device to reset, the PLL to be locked and system code to
be started, before it can be run.
3.5 Power Supply
Power is applied to the device through the IO_VDD and VDD balls. Several balls of
each type are provided to minimize the effect of inductance within the package. All
supply pins must be connected. Each supply should be decoupled close to the chip
by several 100nF low inductance (for example, ceramic) capacitors between IO_VDD
and GND, and VDD and GND.
Input voltages must not exceed specification with respect to IO_VDD, VDD and GND,
even during power up and power down ramping. Permanent damage can occur if the
operation exceeds these ranges.
3.5.1 Power Supply Sequencing
present before the VDD supply. Specifically, the VDDIO and OTP_VDDIO supplies
should rise to their nominal operating range with VDD held at 0V. The VDD supply
should then rise to its nominal operating range with a rise time of less than 10ms.
ESD Model
HBM
MM
Parameters
Reset pulse width for correct start-up
PLL Lock
ISA (BOOT)
2. Voltages with respect to IO VSS
3. Internal pull-up resistors are fitted to general purpose XCore I/O pins. Applies to both
4. Use for unused I/O only—the internal pull up resistor is not recommended as a
XCore I/O and XCore link I/Os.
substitute for an external pull-up resistor.
ESD Stress Voltage
2.0 KV
200 V
www.xmos.com
MIN
100
TYP
MAX
1
100
UNITS
ns
ms
s
Notes
Notes
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