ACS704ELC-005 Allegro Microsystems Inc, ACS704ELC-005 Datasheet - Page 18

SENSOR CURRENT 5A 5V BI 8-SOIC

ACS704ELC-005

Manufacturer Part Number
ACS704ELC-005
Description
SENSOR CURRENT 5A 5V BI 8-SOIC
Manufacturer
Allegro Microsystems Inc
Series
-r
Datasheet

Specifications of ACS704ELC-005

Current - Sensing
±5A
Accuracy
±1%
Sensitivity
133mV/A
Current - Supply
8mA
Sensor Type
Hall Effect
Voltage - Supply
4.5 V ~ 5.5 V
Output
2.5V
Frequency
50kHz
Response Time
8µs
Polarization
Bidirectional
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (0.154", 3.90mm Width)
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ACS704ELC-005
Manufacturer:
LINEAR
Quantity:
7 180
Part Number:
ACS704ELC-005
Manufacturer:
AGILENT
Quantity:
20 000
The Effect of PCB Layout on ACS704 Electrical Performance
Eight different PC boards were fabricated to characterize the effect of PCB design on the operating junction temperature of the
Hall-effect IC inside of the ACS704. These PC boards are shown in the figure below.
were conducted with the following test conditions:

 14 gauge wires were used to connect a power supply to a single PC board. These wires carry the 15 A DC primary current during
 A 15 A DC primary current was applied to a single PC board containing an ACS704 device. This current flowed from pins 1 and
 A 1 mA current was forced from the GND pin to the VCC pin by a Fluke 179 True RMS Multimeter. This was the only power
 The voltage required to force the 1 mA current from the GND pin to the VCC pin was measured after applying the 15 A primary
ACS704ELC005-DS, Rev. 8
Tests were conducted at ambient temperature, T
the tests.
2 to pins 3 and 4 of the ACS704 package.
applied to pins 5-8 of the ACS704 package during testing.
current for approximately 25 minutes. A graph similar to the graph below was used to determine the junction temperature of the
ACS704.
An ACS704 device was soldered onto each PC board before beginning the thermal testing. Thermal management tests
Voltage vs. Temperature Curve used to Determine Die Junction Temperature
2 oz. Cu on one side of board
ACS704ELC-005
A
= 20C. All tests were conducted in still air.
2 oz. Cu on both sides of board
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
17

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