S29GL128S10DHI020 Spansion Inc., S29GL128S10DHI020 Datasheet - Page 91

• Manufacturer Part Number: S29GL128S10DHI020
• Manufacturer: Spansion Inc.

Specifications of S29GL128S10DHI020

• Lead Free Status / Rohs Status: Compliant

February 11, 2011 S29GL_128S_01GS_00_01
11.2.2
Physical Diagram
PACKAGE
JEDEC
SYMBOL
?
SD / SE
D a t a
MD
ME
D1
eD
A1
A2
E1
eE
A
D
E
N
b
MIN
0.40
0.60
0.50
---
S h e e t
9.00 mm x 9.00 mm
PACKAGE
Figure 11.4 LAE064—64-ball Fortified Ball Grid Array (FBGA), 9 x 9 mm
9.00 BSC.
9.00 BSC.
7.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC.
LAE 064
NONE
NOM
0.60
N/A
---
---
---
64
8
8
( A d v a n c e
MAX
1.40
0.70
---
---
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
GL-S MirrorBit
NOTE
I n f o r m a t i o n )
®
Family
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010?
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF
EXCEPT AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN ?
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
DEPOPULATED BALLS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3623 \ 16-038.12 \ 1.16.07
91