EX256-TQG100 Actel, EX256-TQG100 Datasheet - Page 2

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EX256-TQG100

Manufacturer Part Number
EX256-TQG100
Description
Manufacturer
Actel
Datasheets

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Part Number:
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Ordering Information
Note: Automotive grade parts (A grade) devices are tested at room temperature to specifications that have been guard banded based on
Plastic Device Resources
Speed Grade and Temperature Grade Matrix
Contact your local Actel representative for device availability.
ii
Device
eX64
eX128
eX256
Note: Package Definitions: TQFP = Thin Quad Flat Pack, CSP = Chip Scale Package
A
Note: Refer to the
eX Automotive Family FPGAs
characterization across the recommended operating conditions. A-grade parts are not tested at extended temperatures. If testing to
ensure guaranteed operation at extended temperatures is required, please contact your local Actel Sales office to discuss testing
options available.
eX128
and industrial-grade offerings.
Part Number
eX64 =
eX128
eX256
eX Family FPGAs
=
=
64-Pin TQFP
128 Dedicated Flip-Flops (6,000 System Gates)
256 Dedicated Flip-Flops (12,000 System Gates)
64 Dedicated Flip-Flops (3,000 System Gates)
Speed Grade
41
46
Blank=
TQ
P
F
datasheet for more details on commercial-
=
=
Standard Speed
Approximately 30% Faster than Standard
Approximately 40% Slower than Standard
Package Type
TQ = Thin Quad Flat Pack (1.4mm pitch)
CS = Chip-Scale Package (0.8mm pitch)
G
100-Pin TQFP
Lead-Free Packaging
56
70
81
Blank = Standard Packaging
G = RoHS Compliant Packaging
User I/Os (Including Clock Buffers)
100
Std.
Package Lead Count
v3.2
A
49-Pin CSP
Blank = Commercial (0˚C to 70˚C)
Application (Ambient Temperature Range)
36
36
A = Automotive (-40˚C to 125˚C)
I = Industrial (-40˚C to 85˚C)
128-Pin CSP
100
100
84
180-Pin CSP
132

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