EX256 Actel Corporation, EX256 Datasheet

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EX256

Manufacturer Part Number
EX256
Description
Manufacturer
Actel Corporation
Datasheet

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eX Family FPGAs
Leading Edge Performance
Specifications
Features
Product Profile
June 2006
© 2006 Actel Corporation
Device
Capacity
Register Cells
Combinatorial Cells
Maximum User I/Os
Global Clocks
Speed Grades
Temperature Grades*
Package (by pin count)
Note: *Refer to the
TQFP
System Gates
Typical Gates
Dedicated Flip-Flops
Hardwired
Routed
CSP
• 240 MHz System Performance
• 350 MHz Internal Performance
• 3.9 ns Clock-to-Out (Pad-to-Pad)
• 3,000 to 12,000 Available System Gates
• Maximum 512 Flip-Flops (Using CC Macros)
• 0.22µm CMOS Process Technology
• Up to 132 User-Programmable I/O Pins
• High-Performance, Low-Power Antifuse FPGA
• LP/Sleep Mode for Additional Power Savings
• Advanced Small-Footprint Packages
• Hot-Swap Compliant I/Os
• Single-Chip Solution
• Nonvolatile
Maximum Flip-Flops
eX Automotive Family FPGAs
datasheet for details on automotive temperature offerings.
–F, Std, –P
64, 100
49, 128
C, I, A
eX64
3,000
2,000
128
128
64
84
1
2
• Live on Power-Up
• No Power-Up/Down Sequence Required for Supply
• Configurable Weak-Resistor Pull-Up or Pull-Down
• Individual Output Slew Rate Control
• 2.5 V, 3.3 V, and 5.0 V Mixed-Voltage Operation
• Software Design Support with Actel Designer and
• Up to 100% Resource Utilization with 100% Pin
• Deterministic Timing
• Unique In-System Diagnostic and Verification
• Boundary Scan Testing in Compliance with IEEE
• Fuselock™
Voltages
for Tristated Outputs during Power-Up
with 5.0V Input Tolerance and 5.0V Drive Strength
Libero™ Integrated Design Environment (IDE)
Tools
Locking
Capability with Silicon Explorer II
Standard 1149.1 (JTAG)
Prevents Reverse Engineering and Design Theft
–F, Std, –P
64, 100
49, 128
eX128
C, I, A
Secure
6,000
4,000
100
128
256
256
1
2
Programming
–F, Std, –P
128, 180
eX256
12,000
C, I, A
8,000
256
512
512
132
100
1
2
Technology
v4.3
FuseLock
i

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EX256 Summary of contents

Page 1

... Std, – 64, 100 49, 128 datasheet for details on automotive temperature offerings. v4.3 Secure Programming Technology eX128 eX256 6,000 12,000 4,000 8,000 128 256 256 512 256 512 100 132 –F, Std, –P –F, Std, –P ...

Page 2

... Note: Package Definitions:TQFP = Thin Quad Flat Pack, CSP = Chip Scale Package Temperature Grade Offerings Device\Package TQFP 64-Pin eX64 eX128 eX256 Notes Commercial I = Industrial A = Automotive Speed Grade and Temperature Grade Matrix Notes Approximately 30% faster than Standard – ...

Page 3

Table of Contents eX Family FPGAs General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

...

Page 5

Family FPGAs General Description The eX family of FPGAs is a low-cost solution for low- power, high-performance designs. The inherent low power attributes of the antifuse technology, coupled with an additional low static power mode, make these devices ideal ...

Page 6

Family FPGAs Module Organization C-cell and R-cell logic modules are arranged into horizontal banks called Clusters, each of which contains two C-cells and one R-cell in a C-R-C configuration. Clusters are further organized into modules called SuperClusters for improved ...

Page 7

Routing Resources Clusters and SuperClusters can be connected through the use of two innovative local routing resources called FastConnect and DirectConnect, which enable extremely fast and predictable interconnection of modules within Clusters and SuperClusters (Figure architecture also dramatically reduces the ...

Page 8

Family FPGAs Clock Resources eX’s high-drive routing structure provides three clock networks. The first clock, called HCLK, is hardwired from the HCLK buffer to the clock select MUX in each R-Cell. HCLK cannot be connected to combinational logic. This ...

Page 9

Other Architectural Features Performance The combination of architectural features described above enables eX devices to operate with internal clock frequencies exceeding 350 MHz for very fast execution of complex logic functions. The eX family is an optimal platform upon which ...

Page 10

... Table 1-3 illustrates the standby current of eX devices in LP mode. Table 1-3 • Standby Power of eX Devices in LP Mode Typical Conditions, V Product Low Power Standby Current eX64 100 eX128 111 eX256 134 v4.3 Design application note ° 2 CCA CCI ...

Page 11

... V, device tested at room temperature. CCA CCI Figure 1-9 • eX Dynamic Power Consumption – Low Frequency show some sample power characteristics of eX devices. 300 250 200 150 100 100 150 Frequency (MHz Frequency (MHz) v4.3 eX Family FPGAs eX64 eX128 eX256 200 eX64 eX128 eX256 50 1-7 ...

Page 12

Family FPGAs 180 160 140 120 100 Figure 1-10 • Total Dynamic Power (mW) 12,000 10,000 8,000 6,000 4,000 2,000 0 0 Figure 1-11 • System Power at 5%, 10%, and 15% ...

Page 13

Boundary Scan Testing (BST) All eX devices are IEEE 1149.1 compliant. eX devices offer superior diagnostic and testing capabilities by providing Boundary Scan Testing (BST) and probing capabilities. These functions are controlled through the special test pins (TMS, TDI, TCK, ...

Page 14

... Programming Device programming is supported through Silicon Sculptor series of programmers. In particular, Silicon Sculptor compact, robust, single-site and multi-site device programmer for the PC. With standalone software, Silicon Sculptor II allows concurrent programming of multiple units from the same PC, ensuring the fastest programming times possible ...

Page 15

Explorer II's noninvasive method does not alter timing or loading effects, thus shortening the debug cycle. Silicon Explorer II does not require re-layout or additional MUXes to bring signals out to an external pin, which is necessary when using programmable ...

Page 16

Family FPGAs Development Tool Support The eX family of FPGAs is fully supported by both Actel's Libero™ Integrated Design Environment and Designer FPGA Development software. Actel Libero IDE is a design management environment that streamlines the design flow. Libero ...

Page 17

... CCA CCI 3.3V Power Supply Range (V ) CCI 5.0V Power Supply Range (V ) CCI Note: *Ambient temperature ( Table 1-11 • Typical eX Standby Current at 25°C Product eX64 eX128 eX256 Limits –0.3 to +6.0 –0.3 to +3.0 –0.5 to +5.75 –0 –65 to +150 Commercial Industrial 0 to +70 –40 to +85 2.3 to 2.7 2.3 to 2.7 3.0 to 3.6 3.0 to 3.6 4.75 to 5.25 4. ...

Page 18

Family FPGAs 2.5 V LVCMOS2 Electrical Specifications Symbol Parameter MIN CCI MIN CCI MIN, V ...

Page 19

V LVTTL Electrical Specifications Symbol Parameter MIN CCI MIN CCI Input Low Voltage IL ...

Page 20

... eqcm C Comb Modules + ( fn) + (0.5 * (q1 * eqi Input Buffers + (0 RCLKA eqcr + (0 fs1)+(C RCLKB eqhv fp) CCI eqo L Output Buffers of input buffers switching clock eX256 0. eqsm * fq2 eqhf ] at ...

Page 21

C = Equivalent capacitance eqsm modules C = Equivalent capacitance of input buffers eqi C = Equivalent capacitance of routed array clocks eqcr C = Variable capacitance of dedicated array clock eqhv C = Fixed capacitance of dedicated array clock ...

Page 22

Family FPGAs eX Timing Model Input Delays I/O Module t = 0.7 ns INYH Routed t = 1.3 ns RCKH Clock (100% Load) I/O Module t = 1.3 ns INYH Hard-Wired Clock t = 1.1 ns HCKH Note: Values ...

Page 23

Output Buffer Delays 50% 50% GND V OH 1.5 V 1.5 V Out DLH t DHL Table 1-13 • Output Buffer Delays AC Test Loads Load 1 (used to measure propagation delay) To the ...

Page 24

Family FPGAs Input Buffer Delays PAD INBUF 3V In 1 Out 50% GND t t INY INY Table 1-14 • Input Buffer Delays Cell Timing Characteristics D t SUD CLK Q CLR PRESET Figure ...

Page 25

Timing Characteristics Timing characteristics for eX devices fall into three categories: family-dependent, device-dependent, and design-dependent. The input characteristics are common to all eX family members. Internal routing delays are device-dependent. Design dependency means actual delays are not determined until after ...

Page 26

Family FPGAs eX Family Timing Characteristics Table 1-17 • eX Family Timing Characteristics (Worst-Case Commercial Conditions, V Parameter Description 1 C-Cell Propagation Delays t Internal Array Module PD 2 Predicted Routing Delays t FO=1 Routing Delay, DirectConnect DC t ...

Page 27

Table 1-18 • eX Family Timing Characteristics (Worst-Case Commercial Conditions V Parameter Description Dedicated (Hard-Wired) Array Clock Networks t Input LOW to HIGH HCKH (Pad to R-Cell Input) t Input HIGH to LOW HCKL (Pad to R-Cell Input) t Minimum ...

Page 28

Family FPGAs Table 1-19 • eX Family Timing Characteristics (Worst-Case Commercial Conditions V Parameter Description Dedicated (Hard-Wired) Array Clock Networks t Input LOW to HIGH HCKH (Pad to R-Cell Input) t Input HIGH to LOW HCKL (Pad to R-Cell ...

Page 29

Table 1-20 • eX Family Timing Characteristics (Worst-Case Commercial Conditions V Parameter Description 2.5 V LVCMOS Output Module Timing t Data-to-Pad LOW to HIGH DLH t Data-to-Pad HIGH to LOW DHL t Data-to-Pad HIGH to LOW—Low Slew DHLS t Enable-to-Pad, ...

Page 30

Family FPGAs Pin Description CLKA/B Routed Clock A and B These pins are clock inputs for clock distribution networks. Input levels are compatible with standard TTL or LVTTL specifications. The clock input is buffered prior to clocking the R-cells. ...

Page 31

Package Pin Assignments 64-Pin TQFP 64 1 Figure 2-1 • 64-Pin TQFP Note For Package Manufacturing and Environmental information, visit Resource center at http://www.actel.com/products/rescenter/package/index.html. 64-Pin TQFP v4.3 eX Family FPGAs 2-1 ...

Page 32

Family FPGAs 64-Pin TQFP eX64 Pin Number Function 1 GND 2 TDI, I/O 3 I/O 4 TMS 5 GND 6 V CCI 7 I TRST, I GND ...

Page 33

TQFP 100 1 Figure 2-2 • 100-Pin TQFP (Top View) Note For Package Manufacturing and Environmental information, visit Resource center at http://www.actel.com/products/rescenter/package/index.html. 100-Pin TQFP v4.3 eX Family FPGAs 2-3 ...

Page 34

... I/O 48 I/O 49 I/O 50 TRST, I/O 51 I/O 52 I CCI CCI I/O 56 I/O 57 I/O 58 I/O 59 I/O 60 I/O 61 I/O 62 I/O 63 I/O 64 I/O 65 I/O 66 I/O 67 I/O 68 PRB, I CCA v4.3 100-Pin TQFP eX64 eX128 eX256 Function Function Function GND GND GND I/O I/O I/O HCLK HCLK HCLK I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I CCI CCI CCI I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O TDO, I/O TDO, I/O TDO, I/O NC I/O I/O GND GND ...

Page 35

... CLKA CLKA 88 CLKB CLKB CCA CCA 91 GND GND 92 PRA, I/O PRA, I/O 93 I/O I/O 94 I/O I/O 95 I/O I/O 96 I/O I/O 97 I/O I/O 98 I/O I/O 99 I/O I/O 100 TCK, I/O TCK, I/O Note: *Please read the LP pin descriptions for restrictions on their use. eX256 Function I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O V CCI I/O I/O I/O I/O CLKA CLKB NC V CCA GND PRA, I/O I/O I/O I/O I/O I/O I/O I/O TCK, I/O v4.3 eX Family FPGAs 2-5 ...

Page 36

Family FPGAs 49-Pin CSP A1 Ball Pad Corner Figure 2-3 • 49-Pin CSP (Top View) Note For Package Manufacturing and Environmental information, visit Resource center at http://www.actel.com/products/rescenter/package/index.html ...

Page 37

CSP eX64 Pin Number Function A1 I/O A2 I/O A3 I CCA A6 I/O A7 I/O B1 TCK, I/O B2 I/O B3 I/O B4 PRA, I/O B5 CLKA B6 I/O B7* GND/LP* C1 I/O C2 ...

Page 38

Family FPGAs 128-Pin CSP A1 Ball Pad Corner Figure 2-4 • 128-Pin CSP (Top View) Note For Package Manufacturing and Environmental information, visit Resource center at http://www.actel.com/products/rescenter/package/index.html. ...

Page 39

... D12 I/O E1 I/O E2 I/O E3 I/O E4 PRA, I/O E9 CLKB E10 I/O E11* GND/LP* I/O E12 I/O F1 GND F2 I/O F3 I/O F4 TDI, I/O F9 I/O F10 I/O F11 I/O F12 CLKA G1 I/O G2 TRST, I/O I/O G3 I/O G4 I/O G9 I/O G10 v4.3 eX Family FPGAs 128-Pin CSP eX128 eX256 Function Function I/O I/O I/O NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GND GND GND I/O I/O I/O GND GND GND I/O I/O I/O I/O I/O I/O I/O I/O I CCI CCI CCI NC I/O I CCI ...

Page 40

... L1 I CCI CCI V L4 CCA I CCA I CCI CCI I/O L9 I/O L10 I/O L11 GND L12 I/O M1 GND M2 I/O M3 I/O M4 I/O M5 I/O M6 I/O M7 I/O M8 I/O M9 I/O M10 PRB, I/O M11 HCLK M12 v4.3 128-Pin CSP eX64 eX128 eX256 Function Function Function I/O I/O I/O I/O I/O I/O I/O I/O I/O TDO, I/O TDO, I/O TDO, I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O NC I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O NC I/O I CCI CCI CCI ...

Page 41

CSP A1 Ball Pad Corner Figure 2-5 • 180-Pin CSP Note For Package Manufacturing and Environmental information, visit Resource center at http://www.actel.com/products/rescenter/package/index.html ...

Page 42

... I/O H10 E6 I/O H11 E7 GND H12 E8 I/O H13 E9 GND H14 E10 I/O J1 E11 I/O J2 E12 I/O J3 E13 V J4 CCI E14 I/O J5 v4.3 180-Pin CSP eX256 Pin eX256 Function Number Function I/O J10 I/O I/O J11 V CCI V J12 V CCI CCA I/O J13 I/O GND J14 I/O GND K1 I/O I CCA GND/LP CCA CCI I/O K5 ...

Page 43

... M14 I/O N1 I/O N2 GND N3 I/O N4 I/O N5 I/O N6 I CCA N9 I/O N10 I/O N11 I/O N12 I/O N13 I/O N14 I/O P1 I/O P2 I Note: *Please read the LP pin descriptions for restrictions on their use. 180-Pin CSP Pin eX256 Function P10 NC P11 NC P12 GND P13 I/O v4.3 eX Family FPGAs 2-13 ...

Page 44

...

Page 45

Datasheet Information List of Changes The following table lists critical changes that were made in the current version of the document. Previous version Changes in current version (v4.3) v4.2 The "Ordering Information" was also updated. (June 2004) The "Dedicated Test ...

Page 46

... The "TRST, I/O Boundary Scan Reset Pin" section All VSV pins were changed to V 64-Pin TQFP –Pin 36 100-Pin TQFP –Pin 57 49-Pin CSP –Pin D5 128-Pin CSP–Pin H11 and Pin J1 for eX256 180-Pin CSP –Pins J12 and K2 v2.0.1 The "Recommended Operating Conditions" section The " ...

Page 47

... A CS128 pin drawing and pin assignment table including eX64, eX128, and eX256 pin functions have been added. A CS180 pin drawing and pin assignment table for eX256 pin functions have been added. pages 27, 31 Advanced v.1 The following table note was added to the eX Timing Characteristics table for clarification: Clock skew improves as the clock network becomes more heavily loaded. " ...

Page 48

Family FPGAs Datasheet Categories In order to provide the latest information to designers, some datasheets are published before data has been fully characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet Supplement." The definitions of these categories ...

Page 49

... Actel and the Actel logo are registered trademarks of Actel Corporation. All other trademarks are the property of their owners. Actel Corporation Actel Europe Ltd. 2061 Stierlin Court Dunlop House, Riverside Way Mountain View, CA Camberley, Surrey GU15 3YL 94043-4655 USA United Kingdom Phone 650.318.4200 Phone +44 (0) 1276 401 450 Fax 650 ...

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