ADG417BNZ Analog Devices Inc, ADG417BNZ Datasheet - Page 4

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ADG417BNZ

Manufacturer Part Number
ADG417BNZ
Description
IC SWITCH SPST 8DIP
Manufacturer
Analog Devices Inc
Type
Analog Switchr
Datasheet

Specifications of ADG417BNZ

Function
Switch
Circuit
1 x SPST- NO
On-state Resistance
35 Ohm
Current - Supply
1µA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Analog Switch Type
SPST
No. Of Channels
1
On State Resistance Max
25ohm
Turn Off Time
60ns
Turn On Time
100ns
Supply Voltage Range
4.5V To 5.5V
Multiplexer Configuration
Single SPST
Number Of Inputs
1
Number Of Outputs
1
Number Of Channels
1
Analog Switch On Resistance
40@12VOhm
Analog Switch Turn On Time
180ns
Analog Switch Turn Off Time
100ns
Package Type
PDIP
Power Supply Requirement
Single/Dual
Single Supply Voltage (min)
5V
Single Supply Voltage (typ)
9V
Single Supply Voltage (max)
12V
Dual Supply Voltage (min)
±5V
Dual Supply Voltage (typ)
±9/±12V
Dual Supply Voltage (max)
±15V
Power Dissipation
400mW
Supply Current
0.001@±16.5VmA
Mounting
Through Hole
Pin Count
8
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Package
8PDIP
Maximum On Resistance
60@12V Ohm
Maximum High Level Output Current
30 mA
Maximum Turn-off Time
100@±15V ns
Maximum Turn-on Time
180@12V ns
Switch Architecture
SPST
Power Supply Type
Single|Dual
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
ADG417
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
V
Analog, Digital Inputs
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150 C
TERMINOLOGY
V
V
V
GND
S
D
IN
R
I
I
I
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG417 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
S
D
D
DD
DD
SS
L
DD
SS
L
ON
A
(Pulsed at 1 ms, 10% Duty Cycle Max)
Industrial (B Version) . . . . . . . . . . . . . . . . . –40 C to +85 C
Extended (T Version) . . . . . . . . . . . . . . . . –55 C to +125 C
(OFF)
, I
(OFF)
= +25 C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
S
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
(ON)
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
Most positive power supply potential.
Most negative power supply potential in dual
supplies. In single supply applications, it
may be connected to GND.
Logic power supply (+5 V).
Ground (0 V) reference.
Source terminal. May be an input or an
output.
Drain terminal. May be an input or an
output.
Logic control input.
Ohmic resistance between D and S.
Source leakage current with the switch
“OFF.”
“OFF.”
Channel leakage current with the switch
“ON.”
Drain leakage current with the switch
2
. . . . . . . . . . . . . V
or 30 mA, Whichever Occurs First
1
SS
– 2 V to V
DD
DD
+ 0.3 V
+2 V
–4–
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 400 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 400 mW
NOTES
1
2
V
C
C
C
t
t
V
V
I
Charge Injection A measure of the glitch impulse transferred
Off Isolation
I
I
I
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
ON
OFF
INL
DD
SS
L
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
limited to the maximum ratings given.
D
INL
INH
S
D
D
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 C
Lead Temperature, Soldering
, C
(OFF)
JA
JA
(V
(OFF)
Vapor Phase (60 sec). . . . . . . . . . . . . . . . . . . . . . . +215 C
(I
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 100 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155 C/W
S
S
INH
)
(ON)
)
Analog voltage on terminals D, S.
“OFF” switch source capacitance.
“OFF” switch drain capacitance.
“ON” switch capacitance.
Delay between applying the digital control
input and the output switching on.
Delay between applying the digital control
input and the output switching off.
Maximum input voltage for logic “0.”
Minimum input voltage for logic “1.”
Input current of the digital input.
from the digital input to the analog output
during switching.
A measure of unwanted signal coupling
through an “OFF” channel.
Positive supply current.
Negative supply current.
Logic supply current.
WARNING!
ESD SENSITIVE DEVICE
REV. A

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