ADG1223BRMZ Analog Devices Inc, ADG1223BRMZ Datasheet - Page 6
![IC SWITCH DUAL SPST 10MSOP](/photos/6/60/66034/505-10-msop_sml.jpg)
ADG1223BRMZ
Manufacturer Part Number
ADG1223BRMZ
Description
IC SWITCH DUAL SPST 10MSOP
Manufacturer
Analog Devices Inc
Series
iCMOS®r
Datasheet
1.ADG1221BRMZ.pdf
(16 pages)
Specifications of ADG1223BRMZ
Function
Switch
Circuit
2 x SPST - NC/NO
On-state Resistance
270 Ohm
Voltage Supply Source
Single, Dual Supply
Voltage - Supply, Single/dual (±)
10.8 V ~ 13.2 V, ±15 V
Current - Supply
1µA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Analog Switch Type
SPST
No. Of Channels
2
Bandwidth
960MHz
On State Resistance Max
200ohm
Turn Off Time
85ns
Turn On Time
130ns
Supply Voltage Range
10.8V To 13.2V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ADG1221/ADG1222/ADG1223
ABSOLUTE MAXIMUM RATINGS
T
Table 3.
Parameter
V
V
V
Analog Inputs
Digital Inputs
Peak Current, S or D
Continuous Current per
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Overvoltages at IN, S, or D are clamped by internal diodes. Current must be
limited to the maximum ratings given.
DD
DD
SS
A
Channel, S or D
Temperature, Pb free
= 25°C, unless otherwise noted.
to GND
to V
to GND
SS
1
1
Rating
35 V
–0.3 V to +25 V
+0.3 V to −25 V
V
30 mA, whichever occurs first
GND – 0.3 V to V
30 mA, whichever occurs first
100 mA (pulsed at 1 ms,
10% duty cycle max)
30 mA
–40°C to +125°C
–65°C to +150°C
150°C
260°C
SS
– 0.3 V to V
DD
DD
+ 0.3 V or
+ 0.3 V or
Rev. A | Page 6 of 16
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
10-Lead MSOP (4-Layer Board)
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
206
JA
θ
44
JC
Unit
°C/W