ADG1208YRUZ Analog Devices Inc, ADG1208YRUZ Datasheet - Page 17
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ADG1208YRUZ
Manufacturer Part Number
ADG1208YRUZ
Description
IC MULTIPLEXER 8X1 16TSSOP
Manufacturer
Analog Devices Inc
Series
iCMOS®r
Type
Analog Multiplexerr
Datasheet
1.ADG1208YCPZ-REEL7.pdf
(20 pages)
Specifications of ADG1208YRUZ
Function
Multiplexer
Circuit
1 x 8:1
On-state Resistance
270 Ohm
Voltage Supply Source
Single, Dual Supply
Voltage - Supply, Single/dual (±)
10.8 V ~ 13.2 V, ±15 V
Current - Supply
1µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width)
No. Of Circuits
1
Supply Current
220µA
On State Resistance Max
120ohm
Supply Voltage Range
10.8V To 13.2V, ± 13.5V To ± 16.5V
Operating Temperature Range
-40°C To +125°C
Package
16TSSOP
Maximum On Resistance
475@12V/200@±15V Ohm
Maximum Propagation Delay Bus To Bus
130@±15V|170(Typ)@12V ns
Maximum High Level Output Current
30 mA
Multiplexer Architecture
8:1
Maximum Turn-off Time
100@±15V ns
Maximum Turn-on Time
95@±15V ns
Power Supply Type
Single|Dual
Multiplexer Configuration
Single 8:1
Number Of Inputs
8
Number Of Outputs
1
Number Of Channels
1
Analog Switch On Resistance
475@12V/200@±15VOhm
Analog Switch Turn On Time
95ns
Analog Switch Turn Off Time
100ns
Package Type
TSSOP
Power Supply Requirement
Single/Dual
Single Supply Voltage (min)
5V
Single Supply Voltage (typ)
12V
Single Supply Voltage (max)
16.5V
Dual Supply Voltage (min)
±5V
Dual Supply Voltage (typ)
±15V
Dual Supply Voltage (max)
±16.5V
Mounting
Surface Mount
Pin Count
16
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADG1208YRUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
OUTLINE DIMENSIONS
INDICATOR
COPLANARITY
0.25 (0.0098)
0.10 (0.0039)
1.00
0.85
0.80
PIN 1
0.10
4.00 (0.1575)
3.80 (0.1496)
0.15
0.05
12° MAX
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
SEATING
PLANE
4.50
4.40
4.30
PIN 1
Figure 41. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 40. 16-Lead Thin Shrink Small Outline Package [TSSOP]
Figure 42. 16-Lead Standard Small Outline Package [SOIC_N]
BSC
0.65
BSC SQ
16
16
VIEW
1
4.00
TOP
1
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
10.00 (0.3937)
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MS-012-AC
9.80 (0.3858)
Dimensions shown in millimeters and (inches)
4 mm × 4 mm Body, Very Thin Quad (CP-16-4)
COMPLIANT TO JEDEC STANDARDS MO-153-AB
BSC
5.10
5.00
4.90
0.35
0.30
0.25
0.10
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
BSC SQ
0.20 REF
3.75
9
8
Rev. B | Page 17 of 20
1.20
MAX
9
8
Narrow Body (R-16)
SEATING
PLANE
BSC
6.40
0.05 MAX
0.02 NOM
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
(RU-16)
1.75 (0.0689)
1.35 (0.0531)
0.65 BSC
COPLANARITY
0.60 MAX
0.20
0.09
0.75
0.60
0.50
0.08
0.25 (0.0098)
0.17 (0.0067)
8°
0°
12
9
13
8
8°
0°
(BOTTOM VIEW)
0.60 MAX
16
5
1.95 BSC
0.50 (0.0197)
0.25 (0.0098)
1
4
1.27 (0.0500)
0.40 (0.0157)
0.75
0.60
0.45
0.25 MIN
PIN 1
INDICATOR
45°
ADG1208/ADG1209