LFEC3E-4F256C Lattice, LFEC3E-4F256C Datasheet - Page 32
LFEC3E-4F256C
Manufacturer Part Number
LFEC3E-4F256C
Description
IC FPGA 3.1KLUTS 160I/O 256-BGA
Manufacturer
Lattice
Datasheet
1.LFEC3E-5TN144C.pdf
(163 pages)
Specifications of LFEC3E-4F256C
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
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Part Number:
LFEC3E-4F256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
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Lattice Semiconductor
Figure 2-34. LatticeECP/EC Banks
LatticeECP/EC devices contain two types of sysI/O buffer pairs.
1. Top and Bottom sysI/O Buffer Pairs (Single-Ended Outputs Only)
2. Left and Right sysI/O Buffer Pairs (Differential and Single-Ended Outputs)
The sysI/O buffer pairs in the top and bottom banks of the device consist of two single-ended output drivers
and two sets of single-ended input buffers (both ratioed and referenced). The referenced input buffer can also
be configured as a differential input.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
Only the I/Os on the top and bottom banks have programmable PCI clamps. These I/O banks also support hot
socketing with IDK less than 1mA. Note that the PCI clamp is enabled after V
operating levels and the device has been configured.
The sysI/O buffer pairs in the left and right banks of the device consist of two single-ended output drivers, two
sets of single-ended input buffers (both ratioed and referenced) and one differential output driver. The refer-
enced input buffer can also be configured as a differential input. In these banks the two pads in the pair are
described as “true” and “comp”, where the true pad is associated with the positive side of the differential I/O,
and the comp (complementary) pad is associated with the negative side of the differential I/O.
Only the left and right banks have LVDS differential output drivers. See the I
rent during power-up.
V
V
V
V
V
V
GND
GND
REF1(7)
REF2(7)
CCIO7
CCIO6
REF2(6)
REF1(6)
Bank 0
Bank 5
BOTTOM
2-29
TOP
Bank 1
Bank 4
LatticeECP/EC Family Data Sheet
DK
CC
specification for I/O leakage cur-
, V
V
V
V
V
V
V
GND
GND
CCAUX
REF1(2)
REF2(2)
REF2(3)
REF1(3)
CCIO2
CCIO3
and V
CCIO
Architecture
are at valid
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