6-1462037-2 TE Connectivity, 6-1462037-2 Datasheet - Page 3

• Manufacturer Part Number: 6-1462037-2
• Description: RELAY TELECOM DPDT 6VDC SMD
• Manufacturer: TE Connectivity
• Series: IM, AXICOMr

Specifications of 6-1462037-2

• Relay Type: Telecom
• Contact Form: DPDT (2 Form C)
• Contact Rating (current): 2A
• Switching Voltage: 250VAC, 220VDC - Max
• Coil Type: Latching, Single Coil
• Coil Current: 16.7mA
• Coil Voltage: 6VDC
• Turn On Voltage (max): 4.5 VDC
• Turn Off Voltage (min): -
• Features: Sealed - Hermetically
• Mounting Type: Surface Mount
• Termination Style: Gull Wing
• Contact Material: Palladium (Pd), Ruthenium (Ru), Gold (Au)
• Operate Time: 3ms
• Release Time: 3ms
• Coil Power: 100 mW
• Coil Resistance: 360 Ohms
• Operating Temperature: -40°C ~ 85°C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: IM44GR

THT Version
Standard Version
THT Version
Standard Version
Mounting Hole Layout
View onto the component side of the PCB (top view)
Mounting Hole Layout
Standard Version
View onto the component side of the PCB (top view)
Standard Version
Terminal Assignment
Relay – top view
Terminal Assignment
Non-Latching Type
Relay – top view
not energized condition
Non-Latching Type
not energized condition
All specifications subject to change. Consult Tyco Electronics for latest specifications.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
THT Version
Standard Version
THT Version
Standard Version
Mounting Hole Layout
View onto the component side of the PCB (top view)
Mounting Hole Layout
Standard Version
View onto the component side of the PCB (top view)
Standard Version
Terminal Assignment
Relay – top view
Terminal Assignment
Non-Latching Type
Relay – top view
not energized condition
Non-Latching Type
not energized condition
All specifications subject to change. Consult Tyco Electronics for latest specifications.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
T
D2
T1
Tw
T2
S
D1
D2
Tw
S
T
D2
T1
Tw
T2
S
D1
D2
Tw
S
10.0±0.08
10.0±0.08
2.20ʱÊ0.15
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
02-2011, Rev. 0211
www.te.com
© 2011 Tyco Electronics Ltd.
Dimensions
THT version
PCB layout
TOP view on component side of PCB
Soldering conditions according IEC 60058-2-58 and
Processing
Recommended soldering conditions
IPC/JEDEC J-STD-020B
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Standard Version
Standard Version
Recommended Soldering Conditions
Terminal Assignment
Relay – top view
Non-Latching Type
not energized condition
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Recommended Reflow Soldering Profile
THT Version
Standard Version
THT Version
Mounting Hole Layout
View onto the component side of the PCB (top view)
Mounting Hole Layout
Standard Version
View onto the component side of the PCB (top view)
Terminal Assignment
Relay – top view
Non-Latching Type
not energized condition
All specifications subject to change. Consult Tyco Electronics for latest specifications.
T
D2
T1
Tw
T2
S
D1
D2
Tw
S
0.40
0.75
0.40
0.75
N/A
3.2
10.0±0.08
10.0±0.08
10.0±0.08
10.0±0.08
2.20ʱÊ0.15
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
2.20ʱÊ0.15
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
Standard version
Standard version
0.40
0.75
0.40
0.75
N/A
0.40
0.75
0.40
0.75
3.2
N/A
3.2
10.0±0.08
10.0±0.08
0.4
0.4
2.20ʱÊ0.15
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
0.40
0.75
0.40
0.75
240°C
180°C
130°C
100°C
N/A
3.2
¯Êmin.Ê0.75
¯Êmin.Ê0.75
0.4
0.4
0.4
0.4
6.0±0.08
6.0±0.08
5.08±0.1
5.08±0.1
0.087ʱÊ0.006
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
¯Êmin.Ê0.75
¯Êmin.Ê0.75
¯Êmin.Ê0.75
¯Êmin.Ê0.75
0.4
0.4
6.0±0.08
6.0±0.08
5.08±0.1
5.08±0.1
6.0±0.08
6.0±0.08
5.08±0.1
5.08±0.1
0.125
0.015
0.029
0.015
0.029
N/A
0.087ʱÊ0.006
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
0.087ʱÊ0.006
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
¯Êmin.Ê0.75
¯Êmin.Ê0.75
6.0±0.08
6.0±0.08
5.08±0.1
5.08±0.1
0.125
0.015
0.029
0.015
0.029
0.125
0.015
0.029
0.015
0.029
N/A
0.087ʱÊ0.006
N/A
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
0.125
0.015
0.029
0.015
0.029
N/A
Narrow Version
Narrow Version
Narrow Version
Narrow Version
Latching Type, 1 Coil
reset condition
Latching Type, 1 Coil
reset condition
Time (s)
Time (s)
20-40sec
Signal Relays
IM Relay
2.20ʱÊ0.15
3.20ʱÊ0.10
0.30ʱÊ0.05
3.20ʱÊ0.15
2.20ʱÊ0.15
0.30ʱÊ0.05
Narrow Version
Narrow Version
Narrow Version
Narrow Version
Latching Type, 1 Coil
reset condition
Latching Type, 1 Coil
reset condition
Narrow Version
Narrow Version
Narrow Version
Narrow Version
Latching Type, 1 Coil
reset condition
Latching Type, 1 Coil
reset condition
Datasheets and product specification ac-
cording to IEC 61810-1 and to be used only
together with the ‘Definitions’ section.
10.0±0.08
10.0±0.08
N/A
3.2
0.4
0.4
AXICOMÊSignalÊRelays
IM Relay
3.20ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
0.30ʱÊ0.05
2.20ʱÊ0.15
0.30ʱÊ0.05
Narrow Version
Narrow Version
Narrow Version
Narrow Version
Latching Type, 1 Coil
reset condition
Latching Type, 1 Coil
reset condition
2.20ʱÊ0.15
3.20ʱÊ0.10
0.30ʱÊ0.05
3.20ʱÊ0.15
2.20ʱÊ0.15
0.30ʱÊ0.05
Narrow version
Narrow version
10.0±0.08
10.0±0.08
10.0±0.08
10.0±0.08
N/A
3.2
N/A
0.4
0.4
3.2
0.4
0.4
2.20ʱÊ0.15
3.20ʱÊ0.10
0.30ʱÊ0.05
3.20ʱÊ0.15
2.20ʱÊ0.15
0.30ʱÊ0.05
Vapor Phase Soldering:
temperature/time profile (lead
and housing peak temperature)
(Continued)
Full line:
Dottedline: processlimits
10.0±0.08
10.0±0.08
0.4
0.4
N/A
3.2
0.4
0.4
¯Êmin.Ê0.75
¯Êmin.Ê0.75
0.087ʱÊ0.006
0.126ʱÊ0.004
0.011ʱÊ0.002
0.126ʱÊ0.006
0.087ʱÊ0.006
0.011ʱÊ0.002
0.4
0.4
0.4
0.4
5.7±0.3
5.7±0.3
3.2±0.1
3.2±0.1
0.125
0.015
0.015
¯Êmin.Ê0.75
¯Êmin.Ê0.75
N/A
¯Êmin.Ê0.75
¯Êmin.Ê0.75
typical
forced
cooling
0.087ʱÊ0.006
0.126ʱÊ0.004
0.011ʱÊ0.002
0.126ʱÊ0.006
0.087ʱÊ0.006
0.011ʱÊ0.002
0.4
0.4
0.087ʱÊ0.006
0.126ʱÊ0.004
0.011ʱÊ0.002
0.126ʱÊ0.006
0.087ʱÊ0.006
0.011ʱÊ0.002
5.7±0.3
5.7±0.3
5.7±0.3
5.7±0.3
3.2±0.1
3.2±0.1
3.2±0.1
3.2±0.1
0.125
0.015
0.015
0.125
0.015
0.015
¯Êmin.Ê0.75
¯Êmin.Ê0.75
N/A
0.087ʱÊ0.006
N/A
0.126ʱÊ0.004
0.011ʱÊ0.002
0.126ʱÊ0.006
0.087ʱÊ0.006
0.011ʱÊ0.002
5.7±0.3
5.7±0.3
3.2±0.1
3.2±0.1
ContactsÊ inÊ resetÊ position.Ê ContactÊ
positionÊ mightÊ changeÊ duringÊ trans -
portationÊ andÊ mustÊ beÊ resetÊ beforeÊ
ContactsÊ inÊ resetÊ position.Ê ContactÊ
use.
positionÊ mightÊ changeÊ duringÊ trans -
portationÊ andÊ mustÊ beÊ resetÊ beforeÊ
use.
0.125
0.015
0.015
N/A
ContactsÊ inÊ resetÊ position.Ê ContactÊ
positionÊ mightÊ changeÊ duringÊ trans -
portationÊ andÊ mustÊ beÊ resetÊ beforeÊ
ContactsÊ inÊ resetÊ position.Ê ContactÊ
use.
positionÊ mightÊ changeÊ duringÊ trans -
portationÊ andÊ mustÊ beÊ resetÊ beforeÊ
use.
SMT Version
Gull Wings
SMT Version
Gull Wings
Coplanarity ≤ 0.1mm
Solder Pad Layout
Coplanarity ≤ 0.1mm
View onto the component side of the PCB (top view)
Solder Pad Layout
Gull Wings
View onto the component side of the PCB (top view)
Gull Wings
ContactsÊ inÊ resetÊ position.Ê ContactÊ
positionÊ mightÊ changeÊ duringÊ trans -
portationÊ andÊ mustÊ beÊ resetÊ beforeÊ
ContactsÊ inÊ resetÊ position.Ê ContactÊ
use.
positionÊ mightÊ changeÊ duringÊ trans -
portationÊ andÊ mustÊ beÊ resetÊ beforeÊ
use.
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Recommended Soldering Conditions
Recommended Reflow Soldering Profile
Resistance to Soldering Heat - Reflow Profile
0.4
0.4
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
2.20ʱÊ0.15
7.50ʱÊ0.30
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
Recommended Soldering Conditions
Recommended Reflow Soldering Profile
Resistance to Soldering Heat - Reflow Profile
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
SMT version
Recommended reflow soldering profile
Resistance to soldering heat - Reflow profile
ContactsÊ inÊ resetÊ position.Ê ContactÊ
positionÊ mightÊ changeÊ duringÊ trans -
portationÊ andÊ mustÊ beÊ resetÊ beforeÊ
ContactsÊ inÊ resetÊ position.Ê ContactÊ
use.
positionÊ mightÊ changeÊ duringÊ trans -
portationÊ andÊ mustÊ beÊ resetÊ beforeÊ
use.
SMT Version
Gull Wings
SMT Version
Gull Wings
Coplanarity ≤ 0.1mm
Solder Pad Layout
Coplanarity ≤ 0.1mm
View onto the component side of the PCB (top view)
Solder Pad Layout
Gull Wings
View onto the component side of the PCB (top view)
Gull Wings
N/A
N/A
N/A
0.4
SMT Version
0.4
Gull Wings
SMT Version
Gull Wings
10.0±0.08
10.0±0.08
Coplanarity ≤ 0.1mm
Solder Pad Layout
Coplanarity ≤ 0.1mm
View onto the component side of the PCB (top view)
Solder Pad Layout
Gull Wings
View onto the component side of the PCB (top view)
Gull Wings
0.4
0.4
0.4
0.4
2.20ʱÊ0.15
7.50ʱÊ0.30
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
2.20ʱÊ0.15
7.50ʱÊ0.30
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
SMT Version
Gull Wings
SMT Version
Gull Wings
Coplanarity ≤ 0.1mm
Solder Pad Layout
Coplanarity ≤ 0.1mm
View onto the component side of the PCB (top view)
Solder Pad Layout
Gull Wings
View onto the component side of the PCB (top view)
Gull Wings
N/A
N/A
N/A
N/A
0.4
0.4
N/A
10.0±0.08
10.0±0.08
N/A
0.4
0.4
10.0±0.08
10.0±0.08
0.4
0.4
2.20ʱÊ0.15
7.50ʱÊ0.30
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
Gull wings
Gull wings
240°C
180°C
130°C
100°C
240°C
180°C
130°C
100°C
N/A
N/A
N/A
10.0±0.08
10.0±0.08
0.4
0.4
Coplanarity ≤0.1mm
Coplanarity ≤0.1mm
0.087ʱÊ0.006
0.295ʱÊ0.011
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
5.08±0.1
5.08±0.1
7.5±0.3
7.5±0.3
6.0±0.08
6.0±0.08
Coplanarity ≤0.1mm
Coplanarity ≤0.1mm
Coplanarity ≤0.1mm
Coplanarity ≤0.1mm
0.015
0.015
N/A
N/A
N/A
0.087ʱÊ0.006
0.295ʱÊ0.011
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
0.087ʱÊ0.006
0.295ʱÊ0.011
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
5.08±0.1
5.08±0.1
7.5±0.3
7.5±0.3
6.0±0.08
6.0±0.08
5.08±0.1
5.08±0.1
7.5±0.3
7.5±0.3
6.0±0.08
6.0±0.08
Coplanarity ≤0.1mm
Coplanarity ≤0.1mm
0.015
0.015
0.015
0.015
N/A
N/A
N/A
N/A
0.087ʱÊ0.006
0.295ʱÊ0.011
0.200ʱÊ0.004
N/A
0.126ʱÊ0.006
0.087ʱÊ0.006
N/A
5.08±0.1
5.08±0.1
7.5±0.3
7.5±0.3
6.0±0.08
6.0±0.08
0.015
0.015
Time (s)
Time (s)
Time (s)
N/A
N/A
N/A
Time (s)
Time (s)
Time (s)
20-40sec
20-40sec
2.20ʱÊ0.15
2.80ʱÊ0.20
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
J-Legs
J-Legs
Coplanarity ≤ 0.1mm
Coplanarity ≤ 0.1mm
AXICOMÊSignalÊRelays
IM Relay
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
AXICOMÊSignalÊRelays
IM Relay
N/A
N/A
N/A
0.4
0.4
2.20ʱÊ0.15
2.80ʱÊ0.20
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
10.0±0.08
10.0±0.08
2.20ʱÊ0.15
2.80ʱÊ0.20
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
J-Legs
J-Legs
Coplanarity ≤ 0.1mm
Coplanarity ≤ 0.1mm
J-Legs
J-Legs
Coplanarity ≤ 0.1mm
Coplanarity ≤ 0.1mm
J-legs
J-legs
N/A
N/A
N/A
N/A
0.4
N/A
0.4
N/A
0.4
0.4
Full line:
Dottedline: processlimits
2.20ʱÊ0.15
2.80ʱÊ0.20
5.08ʱÊ0.10
3.20ʱÊ0.15
2.20ʱÊ0.15
10.0±0.08
10.0±0.08
Full line:
Dottedline: processlimits
10.0±0.08
10.0±0.08
J-Legs
J-Legs
Coplanarity ≤ 0.1mm
Coplanarity ≤ 0.1mm
Infrared Soldering: temperature/
time profile (lead and housing
peak temperature)
N/A
N/A
N/A
0.4
0.4
10.0±0.08
10.0±0.08
0.4
0.4
Coplanarity ≤0.1mm
Coplanarity ≤0.1mm
0.087ʱÊ0.006
0.110ʱÊ0.007
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
typical
forced
cooling
0.4
0.4
typical
forced
cooling
0.4
5.08±0.1
0.4
5.08±0.1
6.0±0.08
6.0±0.08
Coplanarity ≤0.1mm
Coplanarity ≤0.1mm
0.015
0.015
Coplanarity ≤0.1mm
Coplanarity ≤0.1mm
N/A
N/A
N/A
108-98001 Rev. M
0.087ʱÊ0.006
0.110ʱÊ0.007
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
0.087ʱÊ0.006
0.110ʱÊ0.007
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
Axicom
5 of 28
5 of 28
0.4
0.4
5.08±0.1
5.08±0.1
6.0±0.08
6.0±0.08
5.08±0.1
Coplanarity ≤0.1mm
5.08±0.1
Coplanarity ≤0.1mm
6.0±0.08
6.0±0.08
0.015
0.015
0.015
0.015
N/A
N/A
N/A
N/A
N/A
N/A
0.087ʱÊ0.006
0.110ʱÊ0.007
0.200ʱÊ0.004
0.126ʱÊ0.006
0.087ʱÊ0.006
2.8±0.2
2.8±0.2
5 of 28
5 of 28
5 of 28
5 of 28
5.08±0.1
5.08±0.1
6.0±0.08
6.0±0.08
0.015
0.015
N/A
N/A
N/A
2.8±0.2
2.8±0.2
2.8±0.2
2.8±0.2
5 of 28
5 of 28
2.8±0.2
2.8±0.2
3
Vapo
(Lead
Infrar
(Lead
Infrar
(Lead
Vap
(Lea
Infra
(Lea
Infra
(Lea