DG412DY Intersil, DG412DY Datasheet - Page 11
![IC SWITCH QUAD SPST 16SOIC](/photos/5/65/56533/20-16-soic_sml.jpg)
DG412DY
Manufacturer Part Number
DG412DY
Description
IC SWITCH QUAD SPST 16SOIC
Manufacturer
Intersil
Type
Analog Switchr
Datasheet
1.DG411DYZ.pdf
(13 pages)
Specifications of DG412DY
Function
Switch
Circuit
4 x SPST - NC
On-state Resistance
35 Ohm
Voltage Supply Source
Single, Dual Supply
Voltage - Supply, Single/dual (±)
5 V ~ 44 V, ±5 V ~ 20 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
Multiplexer Configuration
Quad SPST
Number Of Inputs
4
Number Of Outputs
4
Number Of Channels
4
Analog Switch On Resistance
80@10.8VOhm
Analog Switch Turn On Time
250ns
Analog Switch Turn Off Time
145ns
Package Type
SOIC N
Power Supply Requirement
Single/Dual
Single Supply Voltage (min)
5V
Single Supply Voltage (typ)
9/12/15/18/24/28V
Single Supply Voltage (max)
44V
Dual Supply Voltage (min)
±5V
Dual Supply Voltage (typ)
±9/±12/±15/±18V
Dual Supply Voltage (max)
±20V
Power Dissipation
35mW
Supply Current
0.001@±16.5VmA
Mounting
Surface Mount
Pin Count
16
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DG412DY
Manufacturer:
SILICONIX
Quantity:
20 000
Part Number:
DG412DY+
Manufacturer:
MAXIM/美信
Quantity:
20 000
Company:
Part Number:
DG412DY+T
Manufacturer:
MAXIM
Quantity:
241
Part Number:
DG412DY+T
Manufacturer:
MAXIM/美信
Quantity:
20 000
Part Number:
DG412DY-E3
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
DG412DY-T1-E3
Manufacturer:
VISHAY
Quantity:
2 300
Part Number:
DG412DY-T1-E3
Manufacturer:
VISHAY/威世
Quantity:
20 000
N
1
Thin Shrink Small Outline Plastic Packages (TSSOP)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E1” does not include interlead flash or protrusions.
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
0.10(0.004)
2
-A-
INDEX
AREA
JEDEC MO-153-AB, Issue E.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
index feature must be located within the crosshatched area.
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
sions are not necessarily exact. (Angles in degrees)
3
e
b
0.05(0.002)
D
M
C A
SEATING PLANE
M
E1
-C-
-B-
B S
A
A1
11
E
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
0.25
M
B
DG411, DG412, DG413
M
L
c
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
E1
D
N
A
b
e
E
L
a
c
0.002
0.033
0.0075
0.0035
0.193
0.169
0.246
0.020
MIN
0
-
0.026 BSC
o
INCHES
16
0.006
MAX
0.043
0.037
0.012
0.008
0.201
0.177
0.256
0.028
8
o
0.05
0.85
0.19
0.09
4.90
4.30
6.25
0.50
MILLIMETERS
MIN
0
-
o
0.65 BSC
16
MAX
1.10
0.15
0.95
0.30
0.20
5.10
4.50
6.50
0.70
8
o
Rev. 1 2/02
June 20, 2007
NOTES
FN3282.13
9
3
4
6
7
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-
-
-
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