K4M563233G-HN75 Samsung Semiconductor, K4M563233G-HN75 Datasheet - Page 2

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K4M563233G-HN75

Manufacturer Part Number
K4M563233G-HN75
Description
Manufacturer
Samsung Semiconductor
Type
Mobile SDRAMr
Datasheet

Specifications of K4M563233G-HN75

Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
7/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3V
Package Type
FBGA
Operating Temp Range
-25C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.7V
Supply Current
130mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
K4M563233G-HN75
Manufacturer:
SAMSUNG
Quantity:
11 350
Part Number:
K4M563233G-HN75
Manufacturer:
SAMSUNG
Quantity:
1 000
Part Number:
K4M563233G-HN75
Manufacturer:
SAMSUNG
Quantity:
1 000
Company:
Part Number:
K4M563233G-HN75
Quantity:
112
ADD
FUNCTIONAL BLOCK DIAGRAM
K4M563233G - F(H)N/G/L/F
CLK
LCKE
CLK
LRAS
CKE
Bank Select
LCBR
CS
LWE
RAS
Timing Register
LCAS
CAS
WE
Latency & Burst Length
Programming Register
Data Input Register
Column Decoder
2M x 32
2M x 32
2M x 32
2M x 32
DQM
LWCBR
Mobile-SDRAM
LDQM
February 2006
LWE
LDQM
DQi

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