HI9P0508-5Z Intersil, HI9P0508-5Z Datasheet - Page 2

• Manufacturer Part Number: HI9P0508-5Z
• Description: IC MULTIPLEXER 8X1 16SOIC
• Manufacturer: Intersil
• Type: Analog Multiplexerr

Specifications of HI9P0508-5Z

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 400 Ohm
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±14 V ~ 16 V
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Package: 16SOIC N
• Maximum On Resistance: 400@±15V Ohm
• Maximum High Level Output Current: 20 mA
• Multiplexer Architecture: 8:1
• Maximum Turn-on Time: 250(Typ)@±15V ns
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
NOTES:
HI1-0506-2
HI1-0506-5
HI4P0506-5
HI4P0506-5Z (Note 1)
HI9P0506-5
HI9P0506-9
HI9P0506-9Z (Note 1)
HI1-0507-2
HI3-0507-5
HI3-0507-5Z
HI1-0508-2
HI1-0508-5
HI3-0508-5
HI3-0508-5Z (Note 1)
HI9P0508-5
HI9P0508-5Z (Notes 1, 2)
HI9P0508-9
HI9P0508-9Z (Note 1)
HI1-0509-2
HI1-0509-4
HI1-0509-5
HI3-0509-5
HI4P0509-5
HI4P0509-5Z (Notes 1, 2)
HI9P0509-5
HI9P0509-5Z (Notes 1, 2)
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
2. Add “96” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
PART NUMBER
2
HI1-506-2
HI1-506-5
HI4P 506-5
HI4P 506-5Z
HI9P506-5
HI9P506-9
HI9P506-9Z
HI1-507-2
HI3-507-5
HI3-507-5Z
HI1-508-2
HI1-508
HI3-508-5
HI3-508-5Z
HI9P508-5
HI9P508-5Z
HI9P508-9
HI9P508-9Z
HI1-509-2
HI1-509-4
HI1-509-5
HI3-509-5
HI4P 509-5
HI4P 509-5Z
HI9P 509-5
HI9P 509-5Z
PART MARKING
HI-506, HI-507, HI-508, HI-509
RANGE (°C)
-55 to +125
-55 to +125
-55 to +125
-40 to +85
-40 to +85
-55 to 125
-40 to +85
-40 to +85
-25 to +85
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
0 to +75
TEMP.
28 Ld CERDIP
28 Ld CERDIP
28 Ld PLCC
28 Ld PLCC (Pb-free)
28 Ld SOIC
28 Ld SOIC
28 Ld SOIC (Pb-free)
28 Ld CERDIP
28 Ld PDIP
28 Ld PDIP (Note 3) (Pb-free) E28.6
16 Ld CERDIP
16 Ld CERDIP
16 Ld PDIP
16 Ld PDIP (Note 3) (Pb-free) E16.3
16 Ld SOIC
16 Ld SOIC (Pb-free)
16 Ld SOIC
16 Ld SOIC (Pb-free)
16 Ld CERDIP
16 Ld CERDIP
16 Ld CERDIP
16 Ld PDIP
20 Ld PLCC
20 Ld PLCC (Pb-free)
16 Ld SOIC
16 Ld SOIC (Pb-free)
PACKAGE
F28.6
F28.6
N28.45
N28.45
M28.3
M28.3
M28.3
F28.6
E28.6
F16.3
F16.3
E16.3
M16.15
M16.15
M16.15
M16.15
F16.3
F16.3
F16.3
E16.3
N20.35
N20.35
M16.15
M16.15
PKG. DWG. #
October 30, 2007
FN3142.8