HI9P0509-5Z Intersil, HI9P0509-5Z Datasheet - Page 22

IC MULTIPLEXER DUAL 4X1 16SOIC

HI9P0509-5Z

Manufacturer Part Number
HI9P0509-5Z
Description
IC MULTIPLEXER DUAL 4X1 16SOIC
Manufacturer
Intersil
Type
Analog Multiplexerr
Datasheet

Specifications of HI9P0509-5Z

Function
Multiplexer
Circuit
2 x 4:1
On-state Resistance
400 Ohm
Voltage Supply Source
Dual Supply
Voltage - Supply, Single/dual (±)
±14 V ~ 16 V
Operating Temperature
0°C ~ 75°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
Package
16SOIC N
Maximum On Resistance
400@±15V Ohm
Maximum High Level Output Current
20 mA
Multiplexer Architecture
4:1
Number Of Channels Per Chip
1
Maximum Turn-on Time
250(Typ)@±15V ns
Power Supply Type
Single|Dual
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HI9P0509-5Z
Manufacturer:
Intersil
Quantity:
313
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. In-
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
sions are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
22
H
A1
α
0.10(0.004)
0.25(0.010)
HI-506, HI-507, HI-508, HI-509
M
L
h x 45
B
M
o
C
M28.3
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AE ISSUE C)
0.0926
0.0040
0.013
0.0091
0.6969
0.2914
0.394
0.01
0.016
MIN
0
o
0.05 BSC
INCHES
28
0.1043
0.0118
0.0200
0.0125
0.7125
0.2992
0.419
0.029
0.050
MAX
8
o
17.70
10.00
MILLIMETERS
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MIN
0
o
1.27 BSC
28
18.10
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
8
o
October 30, 2007
Rev. 0 12/93
NOTES
FN3142.8
9
3
4
5
6
7
-
-
-
-
-
-

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