DG406DYZ Intersil, DG406DYZ Datasheet - Page 13

IC MULTIPLEXER 16X1 28SOIC

DG406DYZ

Manufacturer Part Number
DG406DYZ
Description
IC MULTIPLEXER 16X1 28SOIC
Manufacturer
Intersil
Type
Analog Multiplexerr
Datasheet

Specifications of DG406DYZ

Function
Multiplexer
Circuit
1 x 16:1
On-state Resistance
100 Ohm
Voltage Supply Source
Single, Dual Supply
Voltage - Supply, Single/dual (±)
5 V ~ 34 V, ±5 V ~ 20 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.300", 7.50mm Width)
Package
28SOIC W
Maximum On Resistance
120@12V Ohm
Maximum Propagation Delay Bus To Bus
300@±15V|450@12V ns
Maximum High Level Output Current
30 mA
Multiplexer Architecture
16:1
Maximum Turn-off Time
300@12V ns
Maximum Turn-on Time
600@12V ns
Power Supply Type
Single|Dual
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DG406DYZ
Manufacturer:
Intersil
Quantity:
13 076
Part Number:
DG406DYZ
Manufacturer:
VISHAY/威世
Quantity:
20 000
Small Outline Plastic Packages (SOIC)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions. In-
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
sions are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
SEATING PLANE
M
For information regarding Intersil Corporation and its products, see www.intersil.com
-C-
E
-B-
B S
A
13
H
A1
µ
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
DG406, DG407
C
M28.3
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AE ISSUE C)
0.0926
0.0040
0.013
0.0091
0.6969
0.2914
0.394
0.01
0.016
MIN
0
o
0.05 BSC
INCHES
28
0.1043
0.0118
0.0200
0.0125
0.7125
0.2992
0.419
0.029
0.050
MAX
8
o
17.70
10.00
MILLIMETERS
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MIN
0
o
1.27 BSC
28
18.10
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
8
o
Rev. 0 12/93
March 13, 2006
NOTES
FN3116.9
9
3
4
5
6
7
-
-
-
-
-
-

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