MC74HC4051ADR2G ON Semiconductor, MC74HC4051ADR2G Datasheet - Page 16

• Manufacturer Part Number: MC74HC4051ADR2G
• Description: IC MUX/DEMUX 8X1 16SOIC
• Manufacturer: ON Semiconductor
• Series: 74HCr
• Type: Analog Multiplexerr

Specifications of MC74HC4051ADR2G

• Function: Multiplexer/Demultiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 100 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): ±2 V ~ 6 V, 2 V ~ 12 V
• Current - Supply: 40µA
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• On Resistance (max): 190 Ohms
• Propagation Delay Time: 40 ns
• On Time (max): 245 ns
• Off Time (max): 160 ns
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2 V
• Maximum Power Dissipation: 500 mW
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Bandwidth: 80 MHz
• Mounting Style: SMD/SMT
• Number Of Switches: Single
• Multiplexer Configuration: Single 8:1
• Number Of Inputs: 8
• Number Of Outputs: 1
• Number Of Channels: 1
• Analog Switch On Resistance: 190@4.5VOhm
• Analog Switch Turn On Time: 245ns
• Analog Switch Turn Off Time: 160ns
• Package Type: SOIC
• Power Supply Requirement: Single/Dual
• Single Supply Voltage (min): 2V
• Single Supply Voltage (typ): 3/5V
• Single Supply Voltage (max): 6V
• Dual Supply Voltage (min): ±1V
• Dual Supply Voltage (typ): ±3/±5V
• Dual Supply Voltage (max): ±6V
• Power Dissipation: 500mW
• Mounting: Surface Mount
• Pin Count: 16
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Dc: 0705
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74HC4051ADR2GOS; MC74HC4051ADR2GOS; MC74HC4051ADR2GOSTR

-T-
SEATING
PLANE
16
1
G
D
0.25 (0.010)
-A-
16 PL
MC74HC4051A, MC74HC4052A, MC74HC4053A
M
*For additional information on our Pb-Free strategy and soldering
T
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
9
8
K
B
-B-
S
0.58
16X
A
C
S
P
8 PL
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.25 (0.010)
http://onsemi.com
1
8
CASE 751B-05
M
D SUFFIX
SOIC-16
ISSUE K
6.40
8X
16X
16
M
R
1.12
DIMENSIONS: MILLIMETERS
B
X 45
16
S
9
_
J
PITCH
1.27
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
G
K
M
R
F
J
P
MILLIMETERS
MIN
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
0
1.27 BSC
_
10.00
MAX
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
0.050 BSC
0
INCHES
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_