MC74HC4051ADR2G ON Semiconductor, MC74HC4051ADR2G Datasheet - Page 17

• Manufacturer Part Number: MC74HC4051ADR2G
• Description: IC MUX/DEMUX 8X1 16SOIC
• Manufacturer: ON Semiconductor
• Series: 74HCr
• Type: Analog Multiplexerr

Specifications of MC74HC4051ADR2G

• Function: Multiplexer/Demultiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 100 Ohm
• Voltage Supply Source: Single, Dual Supply
• Voltage - Supply, Single/dual (±): ±2 V ~ 6 V, 2 V ~ 12 V
• Current - Supply: 40µA
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• On Resistance (max): 190 Ohms
• Propagation Delay Time: 40 ns
• On Time (max): 245 ns
• Off Time (max): 160 ns
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2 V
• Maximum Power Dissipation: 500 mW
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Bandwidth: 80 MHz
• Mounting Style: SMD/SMT
• Number Of Switches: Single
• Multiplexer Configuration: Single 8:1
• Number Of Inputs: 8
• Number Of Outputs: 1
• Number Of Channels: 1
• Analog Switch On Resistance: 190@4.5VOhm
• Analog Switch Turn On Time: 245ns
• Analog Switch Turn Off Time: 160ns
• Package Type: SOIC
• Power Supply Requirement: Single/Dual
• Single Supply Voltage (min): 2V
• Single Supply Voltage (typ): 3/5V
• Single Supply Voltage (max): 6V
• Dual Supply Voltage (min): ±1V
• Dual Supply Voltage (typ): ±3/±5V
• Dual Supply Voltage (max): ±6V
• Power Dissipation: 500mW
• Mounting: Surface Mount
• Pin Count: 16
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Dc: 0705
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74HC4051ADR2GOS; MC74HC4051ADR2GOS; MC74HC4051ADR2GOSTR

-T-
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
D
S
S
2X
L/2
C
16
1
MC74HC4051A, MC74HC4052A, MC74HC4053A
0.36
16X
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
16X
K
-V-
0.10 (0.004)
A
REF
G
SOLDERING FOOTPRINT*
PACKAGE DIMENSIONS
M
1
9
8
1.26
16X
T
http://onsemi.com
-U-
U
B
CASE 948F-01
H
DT SUFFIX
TSSOP-16
S
ISSUE B
7.06
N
V
J
17
S
N
DETAIL E
J1
DETAIL E
F
Ç Ç Ç
Ç Ç Ç
SECTION N-N
0.25 (0.010)
DIMENSIONS: MILLIMETERS
É É
É É
M
K1
K
-W-
0.65
PITCH
NOTES:
ANSI Y14.5M, 1982.
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE -W-.
DIM
J1
K1
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.18
0.09
0.09
0.19
0.19
---
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.28
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.007
0.004
0.004
0.007
0.007
MIN
---
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.047
0.006
0.030
0.008
0.006
0.012
0.010
0.011
MAX
8
_