8551401PA Analog Devices Inc, 8551401PA Datasheet - Page 13
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8551401PA
Manufacturer Part Number
8551401PA
Description
Manufacturer
Analog Devices Inc
Datasheet
1.8551401PA.pdf
(16 pages)
Specifications of 8551401PA
Fixed / Adjust / Prog
Precision
Output Voltage (max)
5V
Temperature Coefficient
8.5ppm/°C
Reference Voltage Accuracy (max)
0.3
Line Regulation
0.01%/V
Load Regulation
0.01%/mA
Input Voltage (max)
40V
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
8
Package Type
CDIP
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
OUTLINE DIMENSIONS
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.200 (5.08)
0.200 (5.08)
0.125 (3.18)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.023 (0.58)
0.014 (0.36)
(5.33)
0.210
MAX
PIN 1
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
Figure 27. 8-Lead Ceramic Dual In-Line Package [CERDIP]
MAX
Figure 28. 8-Lead Plastic Dual In-Line Package [PDIP]
0.005 (0.13)
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
Dimensions shown in inches and (millimeters)
Dimensions shown in inches and (millimeters)
8
1
0.400 (10.16)
0.100 (2.54)
0.365 (9.27)
0.355 (9.02)
MIN
0.405 (10.29) MAX
0.100 (2.54) BSC
COMPLIANT TO JEDEC STANDARDS MS-001-BA
BSC
8
1
0.070 (1.78)
0.030 (0.76)
5
4
0.055 (1.40)
MAX
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.005 (0.13)
MIN
4
5
Narrow Body
0.015
(0.38)
MIN
SEATING
PLANE
0.310 (7.87)
0.220 (5.59)
Z-Suffix
P-Suffix
(Q-8)
(N-8)
SEATING
PLANE
0.060 (1.52)
0.015 (0.38)
0.150 (3.81)
MIN
0.015 (0.38)
0.060 (1.52)
GAUGE
PLANE
MAX
15°
0°
0.430 (10.92)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.320 (8.13)
0.290 (7.37)
MAX
0.015 (0.38)
0.008 (0.20)
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
Rev. I | Page 13 of 16
0.0400 (1.02) MAX
0.358 (9.09)
0.342 (8.69)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
SQ
0.0400 (1.02)
0.0100 (0.25)
0.1850 (4.70)
0.1650 (4.19)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.100 (2.54)
0.064 (1.63)
Figure 30. 20-Terminal Ceramic Leadless Chip Carrier [LCC]
0.088 (2.24)
0.054 (1.37)
Figure 29. 8-Lead Metal Header Package [TO-99]
Dimensions shown in inches and (millimeters)
Dimensions shown in inches and (millimeters)
(9.09)
0.358
MAX
SQ
COMPLIANT TO JEDEC STANDARDS MO-002-AK
0.5000 (12.70)
0.0190 (0.48)
0.0160 (0.41)
REFERENCE PLANE
0.0500 (1.27) MAX
MIN
BASE & SEATING PLANE
0.0210 (0.53)
0.0160 (0.41)
0.2500 (6.35) MIN
0.075 (1.91)
0.011 (0.28)
0.007 (0.18)
0.095 (2.41)
0.075 (1.90)
0.055 (1.40)
0.045 (1.14)
0.075 (1.91)
RC-Suffix
J-Suffix
(E-20A)
(H-08)
R TYP
0.2000
REF
(5.08)
BSC
REF
0.1000
(2.54)
BSC
0.1000 (2.54)
19
13
3
18
14
4
2
BOTTOM
BSC
20
VIEW
0.150 (3.81)
1
5
1
0.0340 (0.86)
0.0280 (0.71)
BSC
45° BSC
8
6
4
8
3
9
7
0.200 (5.08)
REF
0.100 (2.54) REF
0.1600 (4.06)
0.1400 (3.56)
45° TYP
0.015 (0.38)
MIN
0.050 (1.27)
BSC
0.028 (0.71)
0.022 (0.56)
REF02
0.0450 (1.14)
0.0270 (0.69)