AM29LV640MB110REI Spansion Inc., AM29LV640MB110REI Datasheet - Page 6

• Manufacturer Part Number: AM29LV640MB110REI
• Manufacturer: Spansion Inc.

Specifications of AM29LV640MB110REI

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 110ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 3 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 7
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 11
Common Flash Memory Interface (CFI) . . . . . . . 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . 27
4
Word/Byte Configuration ........................................................ 11
Requirements for Reading Array Data ................................... 11
Page Mode Read .................................................................... 12
Writing Commands/Command Sequences ............................ 12
Write Buffer ............................................................................. 12
Accelerated Program Operation ............................................. 12
Autoselect Functions .............................................................. 12
Standby Mode ........................................................................ 12
Automatic Sleep Mode ........................................................... 13
RESET#: Hardware Reset Pin ............................................... 13
Output Disable Mode .............................................................. 13
Autoselect Mode..................................................................... 19
Sector Group Protection and Unprotection ............................. 20
Write Protect (WP#) ................................................................ 21
Temporary Sector Group Unprotect ....................................... 21
Secured Silicon Sector Flash Memory Region ....................... 23
Hardware Data Protection ...................................................... 24
Low VCC Write Inhibit ............................................................ 24
Write Pulse “Glitch” Protection ............................................... 24
Logical Inhibit .......................................................................... 24
Power-Up Write Inhibit ............................................................ 24
Reading Array Data ................................................................ 27
Reset Command ..................................................................... 28
Autoselect Command Sequence ............................................ 28
Enter Secured Silicon Sector/Exit Secured Silicon Sector
Command Sequence .............................................................. 28
Word/Byte Program Command Sequence ............................. 28
Unlock Bypass Command Sequence ..................................... 29
Write Buffer Programming ...................................................... 29
Accelerated Program .............................................................. 30
Program Suspend/Program Resume Command Sequence ... 32
Chip Erase Command Sequence ........................................... 33
Table 1. Device Bus Operations .....................................................11
Table 2. Am29LV640MT Top Boot Sector Architecture ..................13
Table 3. Am29LV640MB Bottom Boot Sector Architecture .............16
Table 4. Autoselect Codes, (High Voltage Method) .......................19
Table 5. Am29LV640MT Top Boot Sector Protection .....................20
Table 6. Am29LV640MB Bottom Boot Sector Protection ................20
Figure 1. Temporary Sector Group Unprotect Operation................ 21
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 22
Table 7. Secured Silicon Sector Contents ......................................23
Figure 3. Secured Silicon Sector Protect Verify .............................. 24
Table 8. CFI Query Identification String .............................. 25
Table 9. System Interface String......................................................25
Table 10. Device Geometry Definition................................. 26
Table 11. Primary Vendor-Specific Extended Query........... 27
Figure 4. Write Buffer Programming Operation............................... 31
Figure 5. Program Operation .......................................................... 32
Figure 6. Program Suspend/Program Resume............................... 33
D A T A
Am29LV640MT/B
S H E E T
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 38
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 42
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 42
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 43
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Key to Switching Waveforms. . . . . . . . . . . . . . . . 44
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 45
Erase And Programming Performance. . . . . . . . 57
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 57
TSOP Pin and BGA Package Capacitance . . . . . 58
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 59
Sector Erase Command Sequence ........................................ 33
Erase Suspend/Erase Resume Commands ........................... 35
Command Definitions ............................................................. 36
DQ7: Data# Polling ................................................................. 38
RY/BY#: Ready/Busy#............................................................ 39
DQ6: Toggle Bit I .................................................................... 39
DQ2: Toggle Bit II ................................................................... 40
Reading Toggle Bits DQ6/DQ2 ............................................... 40
DQ5: Exceeded Timing Limits ................................................ 41
DQ3: Sector Erase Timer ....................................................... 41
DQ1: Write-to-Buffer Abort ..................................................... 41
Read-Only Operations ........................................................... 45
Hardware Reset (RESET#) .................................................... 47
Erase and Program Operations .............................................. 48
Temporary Sector Unprotect .................................................. 53
Alternate CE# Controlled Erase and Program Operations ..... 55
TS 048—48-Pin Standard Pinout Thin Small Outline Package
(TSOP) ................................................................................... 59
FBE063—63-Ball Fine-pitch Ball Grid Array (FBGA)
12 x 11 mm Package .............................................................. 60
LAA064—64-Ball Fortified Ball Grid Array (FBGA)
13 x 11 mm Package .............................................................. 61
Figure 7. Erase Operation.............................................................. 34
Table 12. Command Definitions (x16 Mode, BYTE# = V
Table 13. Command Definitions (x8 Mode, BYTE# = V
Figure 8. Data# Polling Algorithm .................................................. 38
Figure 9. Toggle Bit Algorithm........................................................ 40
Table 14. Write Operation Status ................................................... 41
Figure 10. Maximum Negative Overshoot Waveform ................... 42
Figure 11. Maximum Positive Overshoot Waveform..................... 42
Figure 12. Test Setup.................................................................... 44
Table 15. Test Specifications ......................................................... 44
Figure 13. Input Waveforms and
Measurement Levels...................................................................... 44
Figure 14. Read Operation Timings ............................................... 45
Figure 15. Page Read Timings ...................................................... 46
Figure 16. Reset Timings ............................................................... 47
Figure 17. Program Operation Timings.......................................... 49
Figure 18. Accelerated Program Timing Diagram.......................... 49
Figure 19. Chip/Sector Erase Operation Timings .......................... 50
Figure 20. Data# Polling Timings (During Embedded Algorithms). 51
Figure 21. Toggle Bit Timings (During Embedded Algorithms)...... 52
Figure 22. DQ2 vs. DQ6................................................................. 52
Figure 23. Temporary Sector Group Unprotect Timing Diagram ... 53
Figure 24. Sector Group Protect and Unprotect Timing Diagram .. 54
Figure 25. Alternate CE# Controlled Write (Erase/Program)
Operation Timings.......................................................................... 56
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